Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chip

2008 ◽  
Author(s):  
M. Klein ◽  
M. Hutter ◽  
H. Oppermann ◽  
T. Fritzsch ◽  
G. Engelmann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Reflow Soldering ◽  
Flip Chip Bonding ◽  
Pixel Detectors

Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps

2002 ◽  
Vol 12 (10) ◽  
pp. 372-374 ◽  
Author(s):  
K. Onodera ◽  
T. Ishii ◽  
S. Aoyama ◽  
S. Sugitani ◽  
M. Tokumitsu
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Flip Chip Bonding ◽  
W Band ◽  
Solder Bumps ◽  
Bonding Technology ◽  
Free Solder

Fluxless flip-chip bonding using a lead-free solder bumping technique

2017 ◽  
Vol 12 (09) ◽  
pp. T09006-T09006 ◽  
Author(s):  
K. Hansen ◽  
S. Kousar ◽  
D. Pitzl ◽  
S. Arab
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Flip Chip Bonding ◽  
Free Solder

Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

2005 ◽  
Vol 34 (1) ◽  
pp. 96-102 ◽  
Author(s):  
Jihye Lee ◽  
Jung H. Kim ◽  
Choong D. Yoo
Keyword(s):  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Flip Chip Bonding ◽  
Free Solder

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding
Sign in / Sign up

Export Citation Format

Share Document