Solder bump height dependence of Josephson chip‐to‐card interconnection inductance using flip‐chip bonding technique

1983 ◽  
Vol 54 (9) ◽  
pp. 5282-5286 ◽  
Author(s):  
Jiro Temmyo ◽  
Katsuhiko Aoki ◽  
Haruo Yoshikiyo ◽  
Shigeyuki Tsurumi ◽  
Yoshiaki Takeuchi
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Bump Height ◽  
Flip Chip Bonding ◽  
Height Dependence ◽  
Bonding Technique

Sn-Ag Solder Bump Formation for Flip-Chip Bonding by Electroplating

2003 ◽  
Vol 150 (10) ◽  
pp. C730 ◽  
Author(s):  
Susumu Arai ◽  
Hideki Akatsuka ◽  
Norio Kaneko
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Flip Chip Bonding

scholarly journals Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

2002 ◽  
Vol 43 (6) ◽  
pp. 1336-1340 ◽  
Author(s):  
Soon-Min Hong ◽  
Choon-Sik Kang ◽  
Jae-Pil Jung
Keyword(s):  
Ultrasonic Wave ◽  
Flip Chip ◽  
Solder Bump ◽  
Flip Chip Bonding

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

40 Gbit/s optical receiver module using a flip-chip bonding technique for device interconnection

1998 ◽  
Vol 34 (5) ◽  
pp. 493 ◽  
Author(s):  
Y. Miyamoto ◽  
M. Yoneyama ◽  
Y. Imai ◽  
K. Kato ◽  
H. Tsunetsugu
Keyword(s):  
Flip Chip ◽  
Optical Receiver ◽  
Flip Chip Bonding ◽  
Receiver Module ◽  
Bonding Technique

Inductance-controlled electroabsorption Modulator modules using the flip-chip bonding technique

2005 ◽  
Vol 23 (2) ◽  
pp. 582-587 ◽  
Author(s):  
T. Hatta ◽  
T. Miyahara ◽  
M. Ishizaki ◽  
N. Okada ◽  
S. Zaizen ◽  
...  
Keyword(s):  
Flip Chip ◽  
Electroabsorption Modulator ◽  
Flip Chip Bonding ◽  
Bonding Technique

scholarly journals Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump

2007 ◽  
Vol 30 (1) ◽  
pp. 27-33 ◽  
Author(s):  
Kun-Mo Chu ◽  
Won-Kyoung Choi ◽  
Young-Chul Ko ◽  
Jin-Ho Lee ◽  
Hyo-Hoon Park ◽  
...  
Keyword(s):  
Flip Chip ◽  
Solder Bump ◽  
Laser Display ◽  
Flip Chip Bonding
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