scholarly journals Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames

Micromachines ◽  
2018 ◽  
Vol 9 (4) ◽  
pp. 181 ◽  
Author(s):  
Koki Tanaka ◽  
Hideki Hirano ◽  
Masafumi Kumano ◽  
Joerg Froemel ◽  
Shuji Tanaka
Keyword(s):  
Atomic Hydrogen ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Cu Bonding

scholarly journals A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging

Sensors ◽  
2015 ◽  
Vol 15 (9) ◽  
pp. 24257-24268 ◽  
Author(s):  
Bo Xie ◽  
Yonghao Xing ◽  
Yanshuang Wang ◽  
Jian Chen ◽  
Deyong Chen ◽  
...  
Keyword(s):  
Vacuum Packaging ◽  
Glass Wafer ◽  
Wafer Level

High-precision wafer-level Cu-Cu bonding for 3DICs

2014 ◽  
Author(s):  
Masashi Okada ◽  
Isao Sugaya ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding

Low Activation Temperature Au/Ti Getter Films for Wafer-Level Vacuum Packaging

2014 ◽  
Vol 64 (5) ◽  
pp. 297-304 ◽  
Author(s):  
M. Wu ◽  
J. Moulin ◽  
G. Agnus ◽  
A. Bosseboeuf
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Activation Temperature

scholarly journals Cu/SiO2CMP Process for Wafer Level Cu Bonding

2013 ◽  
Vol 20 (2) ◽  
pp. 47-51 ◽  
Author(s):  
Minjae Lee ◽  
Sarah Eunkyung Kim ◽  
Sungdong Kim
Keyword(s):  
Wafer Level ◽  
Cu Bonding

Wafer-level hermetic vacuum packaging by bonding with a copper–tin thin film sealing ring

2018 ◽  
Vol 28 (4) ◽  
pp. 044002 ◽  
Author(s):  
Teruhisa Akashi ◽  
Hirofumi Funabashi ◽  
Hideki Takagi ◽  
Yoshiteru Omura ◽  
Yoshiyuki Hata
Keyword(s):  
Thin Film ◽  
Vacuum Packaging ◽  
Wafer Level ◽  
Sealing Ring

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

2013 ◽  
Vol 60 ◽  
pp. 251-259 ◽  
Author(s):  
Fredrik Forsberg ◽  
Niclas Roxhed ◽  
Andreas C. Fischer ◽  
Björn Samel ◽  
Per Ericsson ◽  
...  
Keyword(s):  
Focal Plane ◽  
Large Scale ◽  
Vacuum Packaging ◽  
Focal Plane Arrays ◽  
Heterogeneous Integration ◽  
Wafer Level

Wafer-Level Vacuum Packaging by Thermocompression Bonding Using Silver after Fly-Cut Planarization

2016 ◽  
Vol 75 (9) ◽  
pp. 291-297 ◽  
Author(s):  
C. Liu ◽  
H. Hirano ◽  
J. Froemel ◽  
S. Tanaka
Keyword(s):  
Vacuum Packaging ◽  
Wafer Level ◽  
Thermocompression Bonding

High-Precision Wafer-Level Cu–Cu Bonding for 3-DICs

2015 ◽  
Vol 62 (12) ◽  
pp. 4154-4160 ◽  
Author(s):  
Isao Sugaya ◽  
Masashi Okada ◽  
Hajime Mitsuishi ◽  
Hidehiro Maeda ◽  
Toshimasa Shimoda ◽  
...  
Keyword(s):  
High Precision ◽  
Wafer Level ◽  
Cu Bonding
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