Growth of Buried Oxide Layers of Silicon‐on‐Insulator Structures by Thermal Oxidation of the Top Silicon Layer

1997 ◽  
Vol 144 (6) ◽  
pp. 2205-2210 ◽  
Author(s):  
E. Schroer ◽  
S. Hopfe ◽  
Q. Y. Tong ◽  
U. Gösele ◽  
W. Skorupa
Keyword(s):  
Thermal Oxidation ◽  
Silicon Layer ◽  
Silicon On Insulator ◽  
Oxide Layers ◽  
Buried Oxide

ChemInform Abstract: Growth of Buried Oxide Layers of Silicon-on-Insulator (SOI) Structures by Thermal Oxidation of the Top Silicon Layer.

ChemInform ◽  
2010 ◽  
Vol 28 (43) ◽  
pp. no-no
Author(s):  
E. SCHROER ◽  
S. HOPFE ◽  
Q. Y. TONG ◽  
U. GOESELE ◽  
W. SKORUPA
Keyword(s):  
Thermal Oxidation ◽  
Silicon Layer ◽  
Silicon On Insulator ◽  
Oxide Layers ◽  
Buried Oxide

Behavior of contact-silicided TFSOI gate structures

1994 ◽  
Vol 52 ◽  
pp. 860-861
Author(s):  
N. David Theodore ◽  
Juergen Foerstner ◽  
Peter Fejes
Keyword(s):  
Semiconductor Device ◽  
Series Resistance ◽  
Field Effect Transistors ◽  
Silicon Layer ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
Continuous Layer ◽  
Buried Oxide ◽  
Device Structures ◽  
Thin Silicon

As semiconductor device dimensions shrink and packing-densities rise, issues of parasitic capacitance and circuit speed become increasingly important. The use of thin-film silicon-on-insulator (TFSOI) substrates for device fabrication is being explored in order to increase switching speeds. One version of TFSOI being explored for device fabrication is SIMOX (Silicon-separation by Implanted OXygen).A buried oxide layer is created by highdose oxygen implantation into silicon wafers followed by annealing to cause coalescence of oxide regions into a continuous layer. A thin silicon layer remains above the buried oxide (~220 nm Si after additional thinning). Device structures can now be fabricated upon this thin silicon layer.Current fabrication of metal-oxidesemiconductor field-effect transistors (MOSFETs) requires formation of a polysilicon/oxide gate between source and drain regions. Contact to the source/drain and gate regions is typically made by use of TiSi2 layers followedby Al(Cu) metal lines. TiSi2 has a relatively low contact resistance and reduces the series resistance of both source/drain as well as gate regions

A thermodynamic model for the growth of buried oxide layers by thermal oxidation

1996 ◽  
Vol 36 (1-3) ◽  
pp. 237-240 ◽  
Author(s):  
E. Schroer ◽  
S. Hopfe ◽  
J.-Y. Huh ◽  
U. Gösele
Keyword(s):  
Thermal Oxidation ◽  
Thermodynamic Model ◽  
Oxide Layers ◽  
Buried Oxide

The Effects of Annealing Temperature on the Characteristics of Buried Oxide Silicon-On-Insulator

1985 ◽  
Vol 53 ◽  
Author(s):  
B.-Y Mao ◽  
P.-H. Chang ◽  
H.W. Lam ◽  
B.W. Shen ◽  
J.A. Keenan
Keyword(s):  
Annealing Temperature ◽  
Silicon Film ◽  
Silicon Layer ◽  
Silicon On Insulator ◽  
Thermal Donor ◽  
Buried Oxide ◽  
Lower Oxygen ◽  
Higher Temperature ◽  
Soi Substrates ◽  
Post Implantation

ABSTRACTThe effects of post implantation annealing on the properties of buried oxide silicon-on-insulator (SOI) substrates in the temperature range of 1150°C to 1300°C have been studied. Microstructural analyses showed that the crystallinity of the top silicon layer was improved at higher annealing temperature. Lower thermal donor generation at 450°C was observed in SOI annealed at higher temperature. The improvement in microstructure and lower thermal donor generation were correlated to the lower oxygen concentration in the top silicon film.

A Review of Silicon-On-Insulator Formation by Oxygen Ion Implantation

1983 ◽  
Vol 27 ◽  
Author(s):  
Russell F. Pinizzotto
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
High Energy ◽  
Silicon On Insulator ◽  
Epitaxial Silicon ◽  
Crystal Silicon ◽  
Buried Oxide ◽  
Soi Technology

ABSTRACTSilicon-on-Insulator structures will be an important technological advance used in future VLSI, VHSIC and threedimensional integrated circuits. The most mature SOI technology other than silicon-on-sapphire is SIMOX, or Separation by Implanted Oxygen. High energy oxygen ions are implanted into single crystal silicon until a stoichiometric buried silicon dioxide layer is formed. After implantation, the material is annealed at high temperature to remove implantation induced defects. The structure is completed by the growth of a thin epitaxial silicon layer. Devices and complex circuits have been successfully fabricated by several research groups. This paper reviews the development of this buried oxide SOI technology from 1973 to 1983. The five major sections discuss the advantages of SOI, the basics of buried oxide formation, the literature published between 1973 and 1983, key issues that must be solved before large scale implementation takes place and, finally, predictions of future developments.

Some Recent Developments in Industrial Ion Implanters

1985 ◽  
Vol 45 ◽  
Author(s):  
Geoff Ryding
Keyword(s):  
Silicon On Insulator ◽  
High Current ◽  
Oxide Layers ◽  
Semiconductor Doping ◽  
Buried Oxide ◽  
Recent Developments ◽  
Silicon On Insulator Technology ◽  
Implanted Devices ◽  
Ion Implanted

ABSTRACTsemiconductor doping. This paper surveys some of the equipment developed at Eaton Corporation in response to the proliferation of ion implanted devices. Developments in both high current (~10mA) and medium current (~1mA) implanters will be discussed.The evolution of dedicated equipment for the production of buried oxide layers (silicon on insulator technology) will also be reviewed.

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