Atomic Layer Deposition of High Dielectric Constant Nanolaminates

2001 ◽  
Vol 148 (4) ◽  
pp. F63 ◽  
Author(s):  
H. Zhang ◽  
R. Solanki
2006 ◽  
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Kyoung H. Kim ◽  
Damon B. Farmer ◽  
Jean-Sebastien M. Lehn ◽  
P. Venkateswara Rao ◽  
Roy G. Gordon

2004 ◽  
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Seong Keun Kim ◽  
Wan-Don Kim ◽  
Kyung-Min Kim ◽  
Cheol Seong Hwang ◽  
Jaehack Jeong

2006 ◽  
Vol 510 (1-2) ◽  
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Yongtaek Hwang ◽  
Kyuyoung Heo ◽  
Chang Hwan Chang ◽  
Man Kil Joo ◽  
Moonhor Ree

2012 ◽  
Vol 516-517 ◽  
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Ming Kwei Lee ◽  
Chih Feng Yen ◽  
Sheng Hsiung Yang ◽  
Jung Chan Lee ◽  
Chi Hsuan Cheng ◽  
...  

The (NH4)2 S treatment was used for the reduction of native oxides and passivation on GaAs. Atomic layer deposited Al2O3 can further remove the residue native oxides and lower the leakage current on (NH4)2S treated GaAs from self-cleaning and high bandgap. For further stacked with high dielectric constant TiO2 also prepared by atomic layer deposition on Al2O3/(NH4)2S treated p-type GaAs MOS capacitor, the leakage currents can reach 1.9 × 10-8 and 3.1 × 10-6 A/cm2 at ± 2 MV/cm. The dielectric constant is 25.


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