Wire Length Distribution for Placements of Computer Logic

1981 ◽  
Vol 25 (3) ◽  
pp. 152-155 ◽  
Author(s):  
W. E. Donath
Keyword(s):  
Length Distribution ◽  
Wire Length ◽  
Computer Logic

Interconnect Limits on Gigascale Integration (GSI)

1997 ◽  
Vol 473 ◽  
Author(s):  
J. A. Davis ◽  
J. D. Meindl
Keyword(s):  
Response Time ◽  
Length Distribution ◽  
Path Model ◽  
System Level ◽  
Wire Length ◽  
Clock Frequency ◽  
Gigascale Integration ◽  
Logic Network ◽  
Binary Switching ◽  
Quantitative Definition

ABSTRACTOpportunities for Gigascale Integration (GSI) are governed by a hierarchy of physical limits. The levels of this hierarchy have been codified as: 1) fundamental, 2) material, 3) device, 4) circuit and 5) system. Many key limits at all levels of the hierarchy can be displayed in the power, P, versus delay, td, plane and the reciprocal length squared, L-2, versus response time, τ, plane. Power, P, is the average power transfer during a binary switching transition and delay, td, is the time required for the transition. Length, L, is the distance traversed by an interconnect that joins two nodes on a chip and response time, τ, characterizes the corresponding interconnect circuit. At the system level of the hierarchy, quantitative definition of both the P versus td and the L-2 versus τ displays requires an estimate of the complete stochastic wiring distribution of a chip.Based on Rent's Rule, a well known empirical relationship between the number of signal input/output terminals on a block of logic and the number of gate circuits with the block, a rigorous derivation of a new complete stochastic wire length distribution for an on-chip random logic network is described. This distribution is compared to actual data for modern microprocessors and to previously described distributions. A methodology for estimating the complete wire length distribution for future GSI products is proposed. The new distribution is then used to enhance the critical path model that determines the maximum clock frequency of a chip; to derive a preliminary power dissipation model for a random logic network; and, to define an optimal architecture of a multilevel interconnect network that minimizes overall chip size. In essence, a new complete stochastic wiring distribution provides a generic basis for maximizing the value obtained from a multilevel interconnect technology.

Optimization Technique of Number of Interconnect Layers and Circuit Area Based on Wire Length Distribution

2004 ◽  
Author(s):  
Takanori Kyogoku ◽  
Junpei Inoue ◽  
Hidenari Nakashima ◽  
Kenichi Okada ◽  
Kazuya Masu
Keyword(s):  
Optimization Technique ◽  
Length Distribution ◽  
Wire Length

Quantitative Derivation and Evaluation of Wire Length Distribution in Three-Dimensional Integrated Circuits Using Simulated Quenching

2006 ◽  
Vol 45 (4B) ◽  
pp. 3260-3265 ◽  
Author(s):  
Jun Deguchi ◽  
Takeaki Sugimura ◽  
Yoshihiro Nakatani ◽  
Takafumi Fukushima ◽  
Mitsumasa Koyanagi
Keyword(s):  
Integrated Circuits ◽  
Three Dimensional ◽  
Length Distribution ◽  
Wire Length
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