Micro-electrical-mechanical system (MEMS) device having a plurality of pairs of reflective element actuators located on opposing sides of a reflective element and a method of manufacture therefor

2005 ◽  
Vol 118 (2) ◽  
pp. 590 ◽  
Author(s):  
Cristian A. Bolle ◽  
Edward Chan
Keyword(s):  
Mechanical System ◽  
Mems Device ◽  
Micro Electrical Mechanical System

scholarly journals DEVELOPMENT OF A NEW STRUCTURE OF 3-DOF PIEZORESISTIVE ACCELEROMETER TO ENHANCE THE SENSITIVITY

2010 ◽  
Vol 13 (2) ◽  
pp. 57-65
Author(s):  
Tan Duc Tran
Keyword(s):  
Mechanical System ◽  
Degrees Of Freedom ◽  
Micro Electro Mechanical System ◽  
Ansys Software ◽  
Mems Sensors ◽  
Mems Technology ◽  
Mems Device ◽  
Three Degrees Of Freedom

Nowadays, the Micro Electro Mechanical System (MEMS) technology’ has been achieved great developments. Accelerometer is one kind of the most popular MEMS sensors due to it's widely applications. In order to fabricate any MEMS device, the design and simulation have been considered seriously. This paper presents a new design of the three degrees of freedom piezoresistive accelerometer to improve the sensitivity, urgent demand from the reality. The ANSYS software was utilized to design, simulate and evaluate the advantages of this new structure compared to other sensors fabricated previously.

Sensing Flow Separation on a Circular Cylinder by Micro-Electrical-Mechanical-System Thermal-Film Sensors

AIAA Journal ◽  
2006 ◽  
Vol 44 (10) ◽  
pp. 2224-2230 ◽  
Author(s):  
J. J. Miau ◽  
J. K. Tu ◽  
J. H. Chou ◽  
G. B. Lee
Keyword(s):  
Circular Cylinder ◽  
Mechanical System ◽  
Flow Separation ◽  
Micro Electrical Mechanical System

Comparison of integrated micro-electrical-mechanical system and piezoelectric accelerometers for machine condition monitoring

2006 ◽  
Vol 220 (8) ◽  
pp. 1135-1146 ◽  
Author(s):  
S Thanagasundram ◽  
F S Schlindwein
Keyword(s):  
Mechanical System ◽  
Condition Monitoring ◽  
Low Cost ◽  
New Technology ◽  
Vibrational Analysis ◽  
Fault Prediction ◽  
Machine Condition ◽  
Machine Condition Monitoring ◽  
Multiple Data ◽  
Micro Electrical Mechanical System

The design and implementation of instrumentation to collect real-time vibrational data from a quasi-steady state machine (a dry vacuum pump) for fault prediction diagnostics is presented. When simultaneous multiple data collection points are required on the same machinery, the use of conventional transducers such as piezoelectric accelerometers becomes impractical due to their price, as each needs an expensive associated charge amplifier. The use of inexpensive micromachined integrated micro-electrical-mechanical system accelerometers such as ADXL105 has been explored here as an alternative to piezoelectric accelerometers for obtaining reliable and predictable data for diagnostics. Surface micromachined accelerometers are a new technology and their usage for vibrational analysis has been conservative due to concerns over increased noise levels and tolerance to high temperatures. In this article, it is shown that such concerns can be allayed. The time and frequency domain vibration signatures obtained using both types of accelerometers are compared. The study shows that ADXL105 accelerometers can be an effective alternative low-cost high-quality solution for machine condition monitoring.

Study of the dynamics of ТПА 350 automatic mill working stand elements

2020 ◽  
Vol 76 (8) ◽  
pp. 830-840
Author(s):  
S. R. Rakhmanov ◽  
V. V. Povorotnii
Keyword(s):  
Mechanical System ◽  
Dynamic Model ◽  
Maximum Amplitude ◽  
Calculation Scheme ◽  
Dynamic Loads ◽  
Forced Oscillations ◽  
Mass Model ◽  
Automatic Mill ◽  
Hollow Billet ◽  
Oscillation Movement

To form a necessary geometry of a hollow billet to be rolled at a pipe rolling line, stable dynamics of the base equipment of the automatic mill working stand has a practical meaning. Among the forces, acting on its parts and elements, significant by value short-time dynamic loads are the least studied phenomena. These dynamic loads arise during transient interaction of the hollow billet, rollers, mandrel and other mill parts at the forced grip of the hollow billet. Basing of the calculation scheme and dynamic model of the mechanical system of the ТПА 350 automatic mill working stand was accomplished. A mathematical model of dynamics of the system “hollow billet (pipe) – working stand” within accepted calculation scheme and dynamic model of the mechanical system elaborated. Influence of technological load of the rolled hollow billet variation in time was accounted, as well as variation of the mechanical system mass, and rigidity of the ТПА 350 automatic mill working stand. Differential equations of oscillation movement for four-mass model of forked sub-systems of the automatic mill working stand were made up, results of their digital calculation quoted. Dynamic displacement of the stand elements in the inter-roller gap obtained, which enabled to estimate the results of amplitude and frequency characteristics of the branches of the mill rollers setting. It was defined by calculation, that the maximum amplitude of the forced oscillations of elements of the ТПА 350 automatic mill working stand within the inter-roller gap does not exceed 2 mm. It is much higher than the accepted value of adjusting parameters of the deformation center of the ТПА 350 automatic mill. A scheme of comprehensive modernization of the rollers setting in the ТПА 350 automatic mill working stand was proposed. It was shown, that increase of rigidity of rollers setting in the ТПА 350 automatic mill working stand enables to stabilize the amplitude of forced oscillations of the working stand elements within the inter-rollers gap and considerably decrease the induced nonuniform hollow billet wall thickness and increase quality of the rolled pipes at ТПА 350.

Analysis of a 2DOF Nonlinear Mechanical System Using the Normal Form Method

2019 ◽  
Author(s):  
David Julian Gonzalez Maldonado ◽  
Peter Hagedorn ◽  
Thiago Ritto ◽  
Rubens Sampaio ◽  
Artem Karev
Keyword(s):  
Normal Form ◽  
Mechanical System ◽  
Nonlinear Mechanical ◽  
Nonlinear Mechanical System ◽  
Normal Form Method

Detecting the 10 Angstroms That Change MEMS Performance

2004 ◽  
Author(s):  
Erika Schutte ◽  
Jack Martin
Keyword(s):  
Thin Films ◽  
Device Performance ◽  
Processing Conditions ◽  
Packaging Process ◽  
Mems Sensor ◽  
Process Characterization ◽  
Measurement Protocol ◽  
Mems Device

Abstract An ellipsometry based measurement protocol was developed to evaluate changes to MEMS sensor surfaces which may occur during packaging using unpatterned test samples. This package-level technique has been used to measure the 0-20 Angstrom thin films that can form or deposit on die during the packaging process for a variety of packaging processing conditions. Correlations with device performance shows this to be a useful tool for packaged MEMS device and process characterization.

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