3D analysis of defects in integrated circuits by one-photon optical- beam-induced current imaging and laser confocal reflectance microscopy

2003 ◽  
Author(s):  
Jelda J. Miranda ◽  
Caesar Saloma
Keyword(s):  
Integrated Circuits ◽  
Optical Beam ◽  
3D Analysis ◽  
Induced Current ◽  
Confocal Reflectance Microscopy ◽  
Reflectance Microscopy ◽  
Optical Beam Induced Current

An Analytical Technique to Assess the Risk of Laser Damage to Encapsulated Integrated Circuits during Package Laser Marking

2008 ◽  
Author(s):  
Joseph Patterson ◽  
Cliff Schuring
Keyword(s):  
Integrated Circuits ◽  
Optical Beam ◽  
Laser Damage ◽  
Induced Current ◽  
Induced Voltage ◽  
Laser Marking ◽  
Thermally Induced ◽  
Analytical Technique ◽  
Optical Beam Induced Current

Abstract Damage to encapsulated integrated circuits has recently been reported due to Laser marking of the package. A method to assess the risk of such damage is presented. The method is an analytical technique using Thermally Induced Voltage Alteration (XIVA) and Optical Beam Induced Current (OBIC) imaging.

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