Two-photon optical beam induced current imaging through the backside of integrated circuits

1997 ◽  
Vol 71 (18) ◽  
pp. 2578-2580 ◽  
Author(s):  
Chris Xu ◽  
Winfried Denk
Author(s):  
Joseph Patterson ◽  
Cliff Schuring

Abstract Damage to encapsulated integrated circuits has recently been reported due to Laser marking of the package. A method to assess the risk of such damage is presented. The method is an analytical technique using Thermally Induced Voltage Alteration (XIVA) and Optical Beam Induced Current (OBIC) imaging.


1999 ◽  
Vol 24 (20) ◽  
pp. 1407 ◽  
Author(s):  
Fu-Jen Kao ◽  
Mao-Kuo Huang ◽  
Yung-Shun Wang ◽  
Sheng-Lung Huang ◽  
Ming-Kwei Lee ◽  
...  

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