Dynamic behavior of internal elements of high-frequency integrated circuits studied by time-resolved optical-beam-induced current (OBIC) method

1991 ◽  
Author(s):  
Harald Bergner ◽  
Klaus Hempel ◽  
Uwe Stamm
Author(s):  
Joseph Patterson ◽  
Cliff Schuring

Abstract Damage to encapsulated integrated circuits has recently been reported due to Laser marking of the package. A method to assess the risk of such damage is presented. The method is an analytical technique using Thermally Induced Voltage Alteration (XIVA) and Optical Beam Induced Current (OBIC) imaging.


1990 ◽  
Vol 12 (1-4) ◽  
pp. 143-148 ◽  
Author(s):  
Harald Bergner ◽  
Tobias Damm ◽  
Uwe Stamm ◽  
Klaus-Peter Stolberg

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