Comparing the transient response of a resistive-type sensor with a thin film thermocouple during the post-exposure bake process

2004 ◽  
Author(s):  
Kenneth G. Kreider ◽  
David P. DeWitt ◽  
Joel B. Fowler ◽  
James E. Proctor ◽  
William A. Kimes ◽  
...  
1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.


2005 ◽  
Author(s):  
Tomoyuki Takeishi ◽  
K. Hayasaki ◽  
Tsuyoshi Shibata

1999 ◽  
Vol 35 (5) ◽  
pp. 2508-2510 ◽  
Author(s):  
J. Jury ◽  
P. George ◽  
J.H. Judy

2007 ◽  
Author(s):  
Kirsten Ruck ◽  
Heiko Weichert ◽  
Steffen Hornig ◽  
Frank Finger ◽  
Göran Fleischer ◽  
...  

2002 ◽  
Vol 408 (1-2) ◽  
pp. 270-274 ◽  
Author(s):  
Helin Zou ◽  
D.M. Rowe ◽  
S.G.K. Williams

2010 ◽  
Author(s):  
Byungki Jung ◽  
Jing Sha ◽  
Florencia Paredes ◽  
Christopher K. Ober ◽  
Michael O. Thompson ◽  
...  

2009 ◽  
Vol 9 (1) ◽  
pp. 562-566 ◽  
Author(s):  
Miyako Shizuno ◽  
Jun Taniguchi ◽  
Kenta Ogino ◽  
Kiyoshi Ishikawa

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