Calibration of A Low-Temperature Cable-Less Lightpipe Pyrometer on The NIST Post-Exposure Bake Test Bed

2006 ◽  
Author(s):  
B.K. Tsai ◽  
K.G. Kreider ◽  
W.A. Kimes
Keyword(s):  
Low Temperature ◽  
Test Bed ◽  
Post Exposure ◽  
Post Exposure Bake

Delamination Analysis of Low-Temperature Processed SU-8 Photoresist for MEMS Device Fabrication

2007 ◽  
Vol 345-346 ◽  
pp. 1397-1400
Author(s):  
Gwang Beom Kim ◽  
Chong Dae Park ◽  
Dong Sun Seo ◽  
Sang Jeen Hong
Keyword(s):  
Low Temperature ◽  
Process Model ◽  
Response Surfaces ◽  
Device Fabrication ◽  
Fractional Factorial ◽  
Neural Network Modeling ◽  
Post Exposure ◽  
Post Exposure Bake ◽  
Mems Device ◽  
Exposure Energy

Negative SU-8 photoresist processed at several levels of lower temperature than conventional approach was investigated, and its low-temperature processing has been characterized in terms of delamination. According to two phases of statistical design of experiment (DOE), initially statistically significant variables of SU-8 photoresist processing were selected, and the selected variables were further investigated to find their effects on delamination of SU-8 microstructure. A three leveled factorial designed experiments were performed followed by a 2(6-1) fractional factorial designed as a screening experiment. Characterizing low-temperature SU-8 photoresist process, 27 samples were fabricated and the degree of delamination was measured. In addition, nine additional samples were fabricated for the purpose of verification. Employing a neural network modeling technique, a process model is established, and response surfaces are generated to investigate the degree of delamination associated with three process parameters: post exposure bake (PEB) temperature, PEB time, and exposure energy. From the response surfaces generated, two significant parameters associated with delamination are identified, and their effects on delamination were analyzed. The higher the post exposure bake (PEB) temperature at a fixed PEB time and the more delamination occurred. In addition, the higher the dose of exposure energy, the lower the temperature at which the delamination begins and the larger the degree of delamination. The results identified acceptable ranges of the three process variables to avoid the delamination of SU-8 film, which in turn might lead to potential defects in MEMS device fabrication.

A novel post exposure bake technique to improve CD uniformity over product wafers

2005 ◽  
Author(s):  
Tomoyuki Takeishi ◽  
K. Hayasaki ◽  
Tsuyoshi Shibata
Keyword(s):  
Post Exposure ◽  
Post Exposure Bake

Effect and procedures of post-exposure bake temperature optimization on the CD uniformity in a mass production environment

2007 ◽  
Author(s):  
Kirsten Ruck ◽  
Heiko Weichert ◽  
Steffen Hornig ◽  
Frank Finger ◽  
Göran Fleischer ◽  
...  
Keyword(s):  
Mass Production ◽  
Production Environment ◽  
Post Exposure ◽  
Temperature Optimization ◽  
Post Exposure Bake

Sub-millisecond post exposure bake of chemically amplified resists by CO 2 laser heat treatment

2010 ◽  
Author(s):  
Byungki Jung ◽  
Jing Sha ◽  
Florencia Paredes ◽  
Christopher K. Ober ◽  
Michael O. Thompson ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Laser Heat Treatment ◽  
Post Exposure ◽  
Chemically Amplified ◽  
Laser Heat ◽  
Post Exposure Bake ◽  
Chemically Amplified Resists

Effect of Post Exposure Bake in Inorganic Electron Beam Resist and Utilizing for Nanoimprint Mold

2009 ◽  
Vol 9 (1) ◽  
pp. 562-566 ◽  
Author(s):  
Miyako Shizuno ◽  
Jun Taniguchi ◽  
Kenta Ogino ◽  
Kiyoshi Ishikawa
Keyword(s):  
Electron Beam ◽  
Post Exposure ◽  
Post Exposure Bake

Examination Of The Mechanism Of The Post Exposure Bake Effect

1988 ◽  
Author(s):  
P. Trefonas III ◽  
B. K. Daniels ◽  
M. J. Eller ◽  
A. Zampini
Keyword(s):  
Post Exposure ◽  
Post Exposure Bake

Evaluation of the new-type ESPACER adopted for its removal after post-exposure bake process

2005 ◽  
Author(s):  
Yoshihiro Saida ◽  
Takashi Okubo ◽  
Jun Sasaki ◽  
Toshio Konishi ◽  
Motohiko Morita
Keyword(s):  
Post Exposure ◽  
New Type ◽  
Post Exposure Bake
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