Frequency and transient response of yoke flux for 45/55 NiFe and CoTaZr thin film write heads

1999 ◽  
Vol 35 (5) ◽  
pp. 2508-2510 ◽  
Author(s):  
J. Jury ◽  
P. George ◽  
J.H. Judy
2018 ◽  
Vol 49 (1) ◽  
pp. 1231-1234
Author(s):  
Chengyuan Dong ◽  
Xianyu Tong ◽  
Haiting Xie ◽  
Lei Zhang ◽  
Guochao Liu ◽  
...  

2000 ◽  
Vol 87 (9) ◽  
pp. 5416-5418 ◽  
Author(s):  
Chris Y. Mao ◽  
Jian-Gang Zhu ◽  
Robert M. White

1995 ◽  
Vol 31 (6) ◽  
pp. 2657-2659 ◽  
Author(s):  
K.B. Klaassen ◽  
J.C.L. van Peppen

1976 ◽  
Vol 12 (6) ◽  
pp. 716-718 ◽  
Author(s):  
J.v. Lier ◽  
G. Koel ◽  
W.v. Gestel ◽  
L. Postma ◽  
J. Gerkema ◽  
...  
Keyword(s):  

1999 ◽  
Vol 35 (2) ◽  
pp. 637-642 ◽  
Author(s):  
C.H. Back ◽  
J. Heidmann ◽  
J. McCord

2004 ◽  
Author(s):  
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David P. DeWitt ◽  
Joel B. Fowler ◽  
James E. Proctor ◽  
William A. Kimes ◽  
...  

2000 ◽  
Vol 626 ◽  
Author(s):  
A. Ravi Kumar ◽  
R.G. Yang ◽  
G. Chen ◽  
J.-P. Fleurial

ABSTRACTWe report theoretical analysis for the transient thermal response of thermoelectric (TE) element and the integrated thin-film devices. It is predicted that the TE element geometry and applied current pulse shape influences the transient response of the system. Analysis for the integrated systems shows that the transient response is affected by the effusivity of the attached mass. This analysis provides a means to examine the effectiveness of thermal management of the thin-film devices, particularly semiconductor lasers, using the transient mode operation of thermoelectric coolers, and also suggests geometry constraints and optimum pulse shapes for an integrated system.


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