Design and development of wafer-level near-infrared micro-camera

2015 ◽  
Author(s):  
John W. Zeller ◽  
Caitlin Rouse ◽  
Harry Efstathiadis ◽  
Pradeep Haldar ◽  
Nibir K. Dhar ◽  
...  
Keyword(s):  
Near Infrared ◽  
Wafer Level ◽  
Design And Development

WLCSP Laminate Removal Using NIR Laser

2018 ◽  
Author(s):  
Chun Haur Khoo
Keyword(s):  
Near Infrared ◽  
Laser Energy ◽  
Photon Emission ◽  
Mechanical Damage ◽  
Consumer Products ◽  
Fault Isolation ◽  
Wafer Level ◽  
Isolation Technique ◽  
Laminate Layer ◽  
Nir Laser

Abstract Driven by the cost reduction and miniaturization, Wafer Level Chip Scale Packaging (WLCSP) has experienced significant growth mainly driven by mobile consumer products. Depending on the customers or manufacturing needs, the bare silicon backside of the WLCSP may be covered with a backside laminate layer. In the failure analysis lab, in order to perform the die level backside fault isolation technique using Photon Emission Microscope (PEM) or Laser Signal Injection Microscope (LSIM), the backside laminate layer needs to be removed. Most of the time, this is done using the mechanical polishing method. This paper outlines the backside laminate removal method of WLCSP using a near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduces the sample preparation time and also reduces the risk of mechanical damage as there is no application of mechanical force. This is an effective method for WLCSP mounted on a PCB board.

Design and development of a fiber-optic immunosensor utilizing near-infrared fluorophores

1996 ◽  
Vol 6 (2) ◽  
pp. 69-75 ◽  
Author(s):  
Maryam I. Daneshvar ◽  
Guillermo A. Casay ◽  
Gabor Patonay ◽  
Malgorzata Lipowska ◽  
Lucjan Strekowski ◽  
...  
Keyword(s):  
Near Infrared ◽  
Fiber Optic ◽  
Design And Development

Design and development of a multi-die embedded micro wafer level package

2008 ◽  
Author(s):  
Vaidyanathan Kripesh ◽  
Vempati Srinivas Rao ◽  
Aditya Kumar ◽  
Gaurav Sharma ◽  
Khong Chee Houe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Design And Development ◽  
Wafer Level Package

Rational Design and Development of Near-Infrared-Emitting Firefly Luciferins Available In Vivo

2012 ◽  
Vol 52 (4) ◽  
pp. 1175-1179 ◽  
Author(s):  
Ryosuke Kojima ◽  
Hideo Takakura ◽  
Takeaki Ozawa ◽  
Yukio Tada ◽  
Tetsuo Nagano ◽  
...  
Keyword(s):  
Rational Design ◽  
Near Infrared ◽  
Design And Development

Design and development of wafer-level short wave infrared micro-camera

2013 ◽  
Author(s):  
Ashok K. Sood ◽  
Robert A. Richwine ◽  
Gopal Pethuraja ◽  
Yash R. Puri ◽  
Je-Ung Lee ◽  
...  
Keyword(s):  
Short Wave ◽  
Wafer Level ◽  
Design And Development ◽  
Short Wave Infrared

Rational Design and Development of Near-Infrared-Emitting Firefly Luciferins Available In Vivo

2012 ◽  
Vol 125 (4) ◽  
pp. 1213-1217 ◽  
Author(s):  
Ryosuke Kojima ◽  
Hideo Takakura ◽  
Takeaki Ozawa ◽  
Yukio Tada ◽  
Tetsuo Nagano ◽  
...  
Keyword(s):  
Rational Design ◽  
Near Infrared ◽  
Design And Development

A Versatile Optical Head for 3D IC TSV Integration Process Control

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 002015-002049
Author(s):  
G. Fresquet
Keyword(s):  
Near Infrared ◽  
Optical Measurement ◽  
Wafer Level ◽  
Large Area ◽  
3D Integration ◽  
Infrared Wavelength ◽  
Quantitative Measurements ◽  
Defects Inspection ◽  
Die Bonding ◽  
Miniaturized Systems

3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of TSV geometries, temporary wafer bonding, wafer thinning, via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range. I. INTRODUCTION AND BACKGROUND ALL roadmaps predict a large spread of 3D heterogeneous integration technologies for the fabrication of miniaturized systems in the coming years1. Beside a large development of new fabrication processes, 3D integration generates new challenges in terms of metrology and defects inspection for wafer/die bonding, thinning and interconnection processes as well as for 3D architectures. Adaptation and/or combination of existing techniques and the development of new techniques become necessary in order to perform non destructive, fast and inspections or quantitative measurements on large area wafers with high lateral and vertical resolutions. In this work we describe results obtained with an optical system combining several microscopy and interferometry techniques.

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