Design and development of a multi-die embedded micro wafer level package

2008 ◽  
Author(s):  
Vaidyanathan Kripesh ◽  
Vempati Srinivas Rao ◽  
Aditya Kumar ◽  
Gaurav Sharma ◽  
Khong Chee Houe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Design And Development ◽  
Wafer Level Package

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

2010 ◽  
Vol 33 (2) ◽  
pp. 377-388 ◽  
Author(s):  
Vempati Srinivasa Rao ◽  
Xiaowu Zhang ◽  
Ho Soon Wee ◽  
Ranjan Rajoo ◽  
C S Premachandran ◽  
...  
Keyword(s):  
Wafer Level ◽  
Design And Development ◽  
Fine Pitch ◽  
Wafer Level Package ◽  
Low K

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

2008 ◽  
Author(s):  
Vempati Srinivasa Rao ◽  
Xiaowu Zhang ◽  
Ho Soon Wee ◽  
Hnin Wai Yin ◽  
C S Premachandran ◽  
...  
Keyword(s):  
Wafer Level ◽  
Design And Development ◽  
Fine Pitch ◽  
Wafer Level Package ◽  
Low K
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