A Versatile Optical Head for 3D IC TSV Integration Process Control
3D Integration of miniaturized systems at wafer level generates new needs of metrology and defects inspection for the control of TSV geometries, temporary wafer bonding, wafer thinning, via interconnects technology and of wafer/die stacks. In this paper we demonstrate the capabilities of a versatile optical measurement system combining several microscopy and interferometry techniques in the visible and near infrared wavelength range. I. INTRODUCTION AND BACKGROUND ALL roadmaps predict a large spread of 3D heterogeneous integration technologies for the fabrication of miniaturized systems in the coming years1. Beside a large development of new fabrication processes, 3D integration generates new challenges in terms of metrology and defects inspection for wafer/die bonding, thinning and interconnection processes as well as for 3D architectures. Adaptation and/or combination of existing techniques and the development of new techniques become necessary in order to perform non destructive, fast and inspections or quantitative measurements on large area wafers with high lateral and vertical resolutions. In this work we describe results obtained with an optical system combining several microscopy and interferometry techniques.