Introduction of a high throughput SPM for defect inspection and process control

2013 ◽  
Author(s):  
H. Sadeghian ◽  
N. B. Koster ◽  
T. C. van den Dool
Keyword(s):  
Process Control ◽  
High Throughput ◽  
Defect Inspection

Ultra-Fast In-Line Inspection for 3D SIC TSV Line - Bonding & Thinning

2012 ◽  
Vol 187 ◽  
pp. 259-264
Author(s):  
Pierre Yves Guittet ◽  
Lars Markwort ◽  
Greg Savage ◽  
Sandip Halder ◽  
Anne Jourdain
Keyword(s):  
Process Control ◽  
High Throughput ◽  
New Technologies ◽  
Consumer Products ◽  
Yield Management ◽  
Defect Classification ◽  
Control Methods ◽  
Production Lines ◽  
Volume Output

The number of consumer products requiring 3D stacked IC (3D SIC) is growing, and volume output is expected to start between 2011 and 2013. R&D centers and production sites are addressing the remaining obstacles to production for these new technologies. To enable fast production ramp, there is urgency to get enablers in place, including advanced, dedicated process control methods. Using an innovative high throughput inspection technology, we show ways to control future 3D SIC production lines, getting data from 100% of the wafers and providing defect classification for yield management.

IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION

2019 ◽  
Vol 2019 (1) ◽  
pp. 000260-000267
Author(s):  
Woo Han Young ◽  
Mike Marshall
Keyword(s):  
Process Control ◽  
Vertical Integration ◽  
High Speed ◽  
Process Development ◽  
Defect Inspection ◽  
Statistical Process ◽  
The Third ◽  
Advanced Packaging ◽  
Third Dimension ◽  
3D Metrology

Abstract Die sizes continue to shrink and packaging technologies continue to evolve, but the common thread for all of them is the need for increased precision and tighter process control limits to achieve final package yield. Nearly all packaging technologies require connections in the third dimension, above or below the die, thus adding, quite literally, a new dimension to inspection and metrology requirements. Increased focus on reliability for automotive, health care and even mobile electronics is driving the need for improved process control solutions. The combination of higher packaging complexity and the need for improved reliability are driving changes to the requirements around inspection and metrology. Vertical integration continues to grow at a pervasive rate and the need for improved process control in the third dimension is growing rapidly in order to ensure reliability. Vertical integration is designed into nearly all packaging forms, including TSV, RDL, WLP, Fan-in, Fan-out, with a focus on continued increase in the number of I/Os, the pitch of features (RDL and bump) and the overall package size increasing. This integration drives the need for 3D metrology of feature height and coplanarity. In addition, the need to augment raw 3D metrology with defect inspection and 2D metrology data enables a comprehensive view (insight) into the packaging process. Achieve total bump process control with the combination of data from: (1) 2D defect detection – voids and shorts, foreign material, misprocessing; (2) 2D metrology – bump diameter, bump position, bump presence; (3) 3D inspection – bump too tall, bump too short, statistical process control (SPC); (4) Auto classifications – data must make sense and be easy to interpret. By combining high speed 2D, 3D metrology with defect inspection and advanced analytics, the quality of process control data can be exponentially improved to enable quick time-to-results for both process development and HVM control. This paper describes the inspection and metrology challenges of bumps in advanced packaging and the next generation high-throughput bump inspection methodology for wafers with extremely high bump counts as well as the data analysis

“Front-end-ization” of the Back-End

2013 ◽  
Vol 2013 (1) ◽  
pp. 000799-000803
Author(s):  
Rajiv Roy
Keyword(s):  
Process Control ◽  
Defect Inspection ◽  
Advanced Process Control ◽  
Front End ◽  
Cost Of Ownership ◽  
Fine Pitch ◽  
Advanced Packaging ◽  
3D Stacking

The trend towards 3D stacking and advanced packaging has significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes being adopted are beginning to resemble the front-end of 20 years ago but with updated and more affordable cost-of ownership capabilities. As an example, 0.5um defect inspection would have been considered a front-end requirement 20 years ago. Today TSV and advanced packaging techniques such as fine-pitch RDL are demanding 0.5u level inspection but at perhaps 10x improvement in wafer throughput and 20x improvement in COO. Other Front-end capabilities ranging from metrology to Advanced Process Control (APC) that are being adopted by the back-end will also be discussed.

High-throughput defect inspection for arbitrarily shaped EUV absorber patterns (Conference Presentation)

2018 ◽  
Author(s):  
Patrick Helfenstein ◽  
Iacopo Mochi ◽  
Rajendran Rajeev ◽  
Sara Fernandez ◽  
Dimitrios Kazazis ◽  
...  
Keyword(s):  
High Throughput ◽  
Defect Inspection

High throughput and dense sampling metrology for process control

2017 ◽  
Author(s):  
Lei Sun ◽  
Tsunehito Kohyama ◽  
Kuniaki Takeda ◽  
Hiroto Nozawa ◽  
Yuji Asakawa ◽  
...  
Keyword(s):  
Process Control ◽  
High Throughput ◽  
Dense Sampling
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