High throughput and dense sampling metrology for process control

Author(s):  
Lei Sun ◽  
Tsunehito Kohyama ◽  
Kuniaki Takeda ◽  
Hiroto Nozawa ◽  
Yuji Asakawa ◽  
...  
2012 ◽  
Vol 187 ◽  
pp. 259-264
Author(s):  
Pierre Yves Guittet ◽  
Lars Markwort ◽  
Greg Savage ◽  
Sandip Halder ◽  
Anne Jourdain

The number of consumer products requiring 3D stacked IC (3D SIC) is growing, and volume output is expected to start between 2011 and 2013. R&D centers and production sites are addressing the remaining obstacles to production for these new technologies. To enable fast production ramp, there is urgency to get enablers in place, including advanced, dedicated process control methods. Using an innovative high throughput inspection technology, we show ways to control future 3D SIC production lines, getting data from 100% of the wafers and providing defect classification for yield management.


2007 ◽  
Vol 177 (4S) ◽  
pp. 52-53
Author(s):  
Stefano Ongarello ◽  
Eberhard Steiner ◽  
Regina Achleitner ◽  
Isabel Feuerstein ◽  
Birgit Stenzel ◽  
...  

1956 ◽  
Vol 48 (2) ◽  
pp. 81-84
Author(s):  
William Priestley ◽  
B. Dudenbostel, Jr.

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