Behavior of materials at dynamic stress conditions using laser-induced shock waves

1993 ◽  
Author(s):  
Irith Gilath ◽  
S. Eliezer ◽  
T. Bar-Noy ◽  
R. Englman ◽  
Z. Jaeger
Keyword(s):  
Shock Waves ◽  
Dynamic Stress ◽  
Stress Conditions

scholarly journals Dynamic Stress Concentration at the Boundary of an Incision at the Plate Under the Action of Weak Shock Waves

2017 ◽  
Vol 11 (3) ◽  
pp. 217-221 ◽  
Author(s):  
Olena Mikulich ◽  
Vasyl’ Shvabyuk ◽  
Heorhiy Sulym
Keyword(s):  
Stress State ◽  
Shock Waves ◽  
Dynamic Stress ◽  
Fourier Transforms ◽  
Weak Shock ◽  
Integral Equation Method ◽  
Boundary Integral ◽  
Dynamic Stresses ◽  
Discrete Fourier Transforms ◽  
Collocation Technique

AbstractThis paper proposes the novel technique for analysis of dynamic stress state of multi-connected infinite plates under the action of weak shock waves. For solution of the problem it uses the integral and discrete Fourier transforms. Calculation of transformed dynamic stresses at the incisions of plates is held using the boundary-integral equation method and the theory of complex variable functions. The numerical implementation of the developed algorithm is based on the method of mechanical quadratures and collocation technique. For calculation of originals of the dynamic stresses it uses modified discrete Fourier transform. The algorithm is effective in the analysis of the dynamic stress state of defective plates.

scholarly journals Investigations into the Potential Abrasive Release of Nanomaterials due to Material Stress Conditions-Part A: Carbon Black Nano-Particulates in Plastic and Rubber Composites

2019 ◽  
Vol 9 (2) ◽  
pp. 214 ◽  
Author(s):  
Johannes Bott ◽  
Roland Franz
Keyword(s):  
Carbon Black ◽  
Dynamic Stress ◽  
Laser Light ◽  
Stress Test ◽  
Stress Conditions ◽  
Rubber Composites ◽  
Test Protocol ◽  
Rubber Compounds ◽  
Plastic Materials ◽  
Surface Particle

Plastic and rubber based composites containing carbon black (CB) were investigated for the potential to release CB nano-particulates under stress conditions into food simulants. Nanocomposites were exposed to thermal, chemical, and mechanical stress, followed by mechanical abrasion of their surface. Particle sensitive asymmetric flow field-flow fractionation (AF4) with multi angle laser light scattering (MALLS) detection was used to detect and quantify CB nano-particulates. This study demonstrates that, even under dynamic stress conditions, CB nano-particulates are not released from the plastic or rubber compounds into food. This study intends also to propose a general nano-release stress test protocol for plastic materials coming into contact with foodstuff.

scholarly journals Performance and Reliability Characterization of 1200 V Silicon Carbide Power MOSFETs and JFETs at High Temperatures

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000228-000234
Author(s):  
Jack Flicker ◽  
David Hughart ◽  
Robert Kaplar ◽  
Stanley Atcitty ◽  
Matthew Marinella
Keyword(s):  
Silicon Carbide ◽  
Leakage Current ◽  
Field Effect ◽  
Dynamic Stress ◽  
Field Effect Transistors ◽  
Linear Increase ◽  
Stress Conditions ◽  
Oxide Semiconductor ◽  
Power Mosfets ◽  
Dynamic Voltage

1200 V Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs) and Junction Field Effect Transistors (JFETs) have been characterized at high operational temperatures. For packaged JFETs obtained from a collaborating manufacturer, the threshold shift (ΔVT) was measured under both static and dynamic voltage stress and, in all cases, was less than 2 mV, which is within the measurement margin of error. Temperatures up to 250°C and stress times as long as 200 hours were evaluated. As a comparison, commercially available SiC MOSFETs demonstrated shifts of up to 300 mV after 30 minutes of static gate stress at 175°C. In addition, results from unpackaged JFET die at temperatures up to 525°C show ΔVT values of less than 10 mV for all stress conditions. Although VT remained unchanged for the duration of the test for both static and dynamic stress conditions, under dynamic stress conditions the JFET packaged parts demonstrated a linear increase in sub-threshold leakage current of around 15.6 nA per hour; in contrast, the MOSFET devices showed an exponential increase in sub-threshold leakage under dynamic stress. The increase in sub-threshold leakage current could be recovered temporarily, but long-term behavior was consistent with cumulative damage.

Unsteady exergy destruction of the neuron under dynamic stress conditions

Energy ◽  
2013 ◽  
Vol 59 ◽  
pp. 422-431 ◽  
Author(s):  
S. Genc ◽  
E. Sorguven ◽  
M. Ozilgen ◽  
I. Aksan Kurnaz
Keyword(s):  
Dynamic Stress ◽  
Stress Conditions ◽  
Exergy Destruction

scholarly journals Investigations into the Potential Abrasive Release of Nanomaterials due to Material Stress Conditions—Part B: Silver, Titanium Nitride, and Laponite Nanoparticles in Plastic Composites

2019 ◽  
Vol 9 (2) ◽  
pp. 221 ◽  
Author(s):  
Johannes Bott ◽  
Roland Franz
Keyword(s):  
Titanium Nitride ◽  
Inductively Coupled Plasma ◽  
Dynamic Stress ◽  
Laser Light ◽  
Stress Conditions ◽  
Field Flow Fractionation ◽  
Inductively Coupled ◽  
Icp Ms ◽  
Plasma Mass Spectrometry ◽  
Surface Particle

Three plastic nanocomposites containing the nanomaterials silver, titanium nitride, and laponite were investigated on the potential to release nanoparticulates under stress conditions into food simulants. Nanocomposites were exposed to thermal, chemical, and mechanical stress followed by mechanical abrasion of their surface. Particle sensitive asymmetric flow field-flow fractionation (AF4) with multi-angle laser light scattering (MALLS) as well as inductively coupled plasma mass spectrometry (ICP-MS) detection was used to detect and quantify the respective nanoparticulates. The results of this study demonstrate that even under dynamic stress conditions nanoparticulates are not released from the nanocomposites into food.

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