Etching with electron beam-generated plasmas: Selectivity versus ion energy in silicon-based films

2021 ◽  
Vol 39 (3) ◽  
pp. 033002
Author(s):  
S. G. Walton ◽  
D. R. Boris ◽  
S. G. Rosenberg ◽  
H. Miyazoe ◽  
E. A. Joseph ◽  
...  
Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1408
Author(s):  
Slawomir Prucnal ◽  
Jerzy Żuk ◽  
René Hübner ◽  
Juanmei Duan ◽  
Mao Wang ◽  
...  

Controlled doping with an effective carrier concentration higher than 1020 cm−3 is a key challenge for the full integration of Ge into silicon-based technology. Such a highly doped layer of both p- and n type is needed to provide ohmic contacts with low specific resistance. We have studied the effect of ion implantation parameters i.e., ion energy, fluence, ion type, and protective layer on the effective concentration of electrons. We have shown that the maximum electron concentration increases as the thickness of the doping layer decreases. The degradation of the implanted Ge surface can be minimized by performing ion implantation at temperatures that are below −100 °C with ion flux less than 60 nAcm−2 and maximum ion energy less than 120 keV. The implanted layers are flash-lamp annealed for 20 ms in order to inhibit the diffusion of the implanted ions during the recrystallization process.


2018 ◽  
Vol 143 ◽  
pp. 03008 ◽  
Author(s):  
Aleksandr Klimov ◽  
Aleksey Zenin

The paper presents research results of peculiarities of gas ion flows usage and their generation from large plasma formation (>50 sq.cm) obtained by electron beam ionization of gas in the forevacuum pressure range. An upgraded source was used for electron beam generation, which allowed obtaining ribbon electron beam with no transmitting magnetic field. Absence of magnetic field in the area of ion flow formation enables to obtain directed ion flows without distorting their trajectories. In this case, independent control of current and ion energy is possible. The influence of electron beam parameters on the parameters of beam plasma and ion flow – current energy and density – was determined. The results of alumina ceramics treatment with a beam plasma ions flow are given.


2002 ◽  
Author(s):  
C.A. Gentile ◽  
H.M. Fan ◽  
J.W. Hartfield ◽  
R.J. Hawryluk ◽  
F. Hegeler ◽  
...  

1996 ◽  
Vol 79 (2) ◽  
pp. 1008 ◽  
Author(s):  
B. Panda ◽  
S. K. Ray ◽  
A. Dhar ◽  
A. Sarkar ◽  
D. Bhattacharya ◽  
...  

2010 ◽  
Author(s):  
Reyhaneh Jannesari ◽  
Iris Bergmair ◽  
Saeid Zamiri ◽  
Kurt Hingerl

2015 ◽  
Vol 183 (3) ◽  
pp. 987-994 ◽  
Author(s):  
Yael Liebes-Peer ◽  
Vedran Bandalo ◽  
Ünsal Sökmen ◽  
Marc Tornow ◽  
Nurit Ashkenasy
Keyword(s):  

2005 ◽  
Vol 863 ◽  
Author(s):  
Jeannette M. Jacques ◽  
Ting Y. Tsui ◽  
Andrew J. McKerrow ◽  
Robert Kraft

AbstractFor 90 nm node devices, the group of materials known as organosilicate glass (OSG) has emerged as the predominant choice for intermetal dielectrics. A potential failure mechanism for this class of low-k dielectric films during the manufacturing process is catastrophic fracture due to channel cracking. The use of an electron beam curing process is being investigated for improvement in the mechanical strength of these silicon-based materials. Within this work, the effects of curing dose (micro-C/cm2) upon the mechanical properties of OSG thin films were characterized. For a set process voltage and current, linear relationships exist between the dose and several mechanical film properties. Channel crack growth velocities were also measured for these cured materials. As the cure dose is increased, the crack growth rate decreases according to a power law relationship. The structural film changes induced by the electron beam cure process are addressed, focusing on their impact upon the mechanical strength of OSG thin films.


2022 ◽  
Vol 105 (1) ◽  
Author(s):  
Michael Hahn ◽  
Thusitha Arthanayaka ◽  
Peter Beiersdorfer ◽  
Gregory V. Brown ◽  
Daniel W. Savin

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