Effect of compressive and tensile strain on misfit dislocation injection in SiGe epitaxial layers

Author(s):  
Werner Wegscheider
1996 ◽  
Vol 89 (3) ◽  
pp. 341-346 ◽  
Author(s):  
W. Wierzchowski ◽  
K. Mazur ◽  
Wł. Strupiński ◽  
K. Wieteska ◽  
W. Graeff

1993 ◽  
Vol 74 (5) ◽  
pp. 3103-3110 ◽  
Author(s):  
G. Patrick Watson ◽  
Dieter G. Ast ◽  
Timothy J. Anderson ◽  
Balu Pathangey

1992 ◽  
Vol 263 ◽  
Author(s):  
Michael A. Capano

ABSTRACTA new mechanism which describes how misfit dislocations in epitaxial layers multiply is presented. This work demonstrates how a single threading dislocation can give rise to an array of dislocation sources, where each source generates a single dislocation loop perpendicular to the primary misfit dislocation. As a threading dislocation with pure screw character glides through an epilayer, certain processes occur which lead to the production of a single dislocation half-loop, and the regeneration of the original threading dislocation. The regenerated threading dislocation continues to propagate on its primary glide plane, which allows the process to repeat itself at some later time. The result of this sequential process is an array of half-loops perpendicular to the primary misfit dislocation. The shape and symmetry of the arrays also contains information regarding how the mechanism operates. The proposed mechanism is related to misfit dislocation arrays in a single Si0.87Ge0.13 layer on Si(001).


Author(s):  
R.R. Kola ◽  
J.B. Posthill ◽  
G.A. Rozgonyi

Heavily boron-doped silicon buried epitaxial layers are becoming increasingly important in the fabrication of thin membranes, three dimensional structures in silicon and latch-up free CMOS circuits. Si(Ge,B) co-doping has been utilized to compensate the B-induced lattice contraction in Si and hence buried high conducting layers which are strain-free and lattice matched to the Si substrate have been realized. The utilization of isoelectronic Ge also alters the point defect distribution in silicon resulting in reduced dopant diffusion which is an added advantage in realizing shallow junctions and reduced interfacial transition width in epitaxial layers. This contribution addresses the evolution of misfit dislocation structure and B precipitation behavior in heavily B-doped buried Si epitaxial layers. In addition, the effect of Ge co-doping on B solubility in Si will be discussed.Silicon epitaxial layers were grown at 1080°C by chemical vapor deposition on 4-inch diameter p-type (100) substrates (10 and 0.04 Ω-cm) employing the SiH2Cl2-B2H6-GeH4-H2 chemical system. Single 5 μm thick epilayers and 2 μm buried layers with 4 μm intrinsic cap layers (10 Ω-cm) were grown.


2019 ◽  
Vol 19 (1) ◽  
pp. 213-221
Author(s):  
Masahiro Fukuda ◽  
Yosuke Shimamune ◽  
Katsuto Tanahashi ◽  
Keiji Ikeda ◽  
Masatoshi Nishikawa ◽  
...  

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