Mechanical properties and residual stress in AlN/Al mixed films prepared by ion-beam-assisted deposition

1999 ◽  
Vol 17 (2) ◽  
pp. 603-607 ◽  
Author(s):  
Yoshihisa Watanabe ◽  
Shingo Uchiyama ◽  
Yoshikazu Nakamura ◽  
Chunlang Li ◽  
Tohru Sekino ◽  
...  
2000 ◽  
Vol 18 (4) ◽  
pp. 1567-1570 ◽  
Author(s):  
Yoshihisa Watanabe ◽  
Nobuaki Kitazawa ◽  
Yoshikazu Nakamura ◽  
Chunliang Li ◽  
Tohru Sekino ◽  
...  

2000 ◽  
Vol 647 ◽  
Author(s):  
Shuichi Miyabe ◽  
Toshiyuki Okawa ◽  
Nobuaki Kitazawa ◽  
Yoshihisa Watanabe ◽  
Yoshikazu Nakamura

AbstractAluminum nitride (AlN) thin films were prepared by ion-beam assisted deposition method, and the influence of the nitrogen ion beam energy on their microstructure and mechanical properties was studied by changing the ion beam energy from 0.1 to 1.5 keV. Films prepared with a low-energy ion beam show a columnar structure, while films prepared with a high-energy ion beam show a granular structure. The film hardness is found to decrease with increasing nitrogen ion beam energy. It is also found that the film hardness does not change drastically after annealing in nitrogen atmosphere at 500 °C, yielding the residual stress relaxation. It is proposed that the film hardness is dependent on the film microstructure, which can be controlled with the nitrogen ion beam energy, rather than the residual stress in the films.


2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
Hongfei Shang ◽  
Jian Li ◽  
Tianmin Shao

TiN/Ta multilayer film with a modulation period of 5.6 nm and modulation ratio of 1 : 1 was produced by ion beam assisted deposition. Microstructure of the as-deposited TiN/Ta multilayer film was observed by transmission electron microscopy and mechanical properties were investigated. Residual stress in the TiN/Ta multilayer film was about 72% of that of a TiN monolayer film with equivalent thickness deposited under the same conditions. Partial residual stress was released in the Ta sublayers during deposition, which led to the decrease of the residual stress of the TiN/Ta multilayer film. Nanohardness (H) of the TiN/Ta multilayer film was 24 GPa, 14% higher than that of the TiN monolayer film. It is suggested that the increase of the nanohardness is due to the introduction of the Ta layers which restrained the growth of TiN crystal and led to the decrease of the grain size. A significant increase (3.5 times) of theH3/E2(Eelastic modulus) value indicated that the TiN/Ta multilayer film has higher elasticity than the TiN monolayer film. TheLc(critical load in nano-scratch test) value of the TiN monolayer film was 45 mN, which was far lower than that of the TiN/Ta multilayer film (around 75 mN). Results of the indentation test showed a higher fracture toughness of the TiN/Ta multilayer film than that of the TiN monolayer film. Results of differential scanning calorimetric (DSC) and thermo gravimetric analysis (TGA) indicate that the TiN/Ta multilayer film has better thermal stability than the TiN monolayer film.


2010 ◽  
Vol 24 (01n02) ◽  
pp. 43-50 ◽  
Author(s):  
L. DONG ◽  
G. Q. LIU ◽  
Y. D. SUN ◽  
M. Y. LIU ◽  
D. J. LI

TiB 2/ Si 3 N 4 nano multilayers have been synthesized under different deposition parameters related to substrate by ion beam assisted deposition (IBAD). XRD, Nano indenter, profiler, and multi-functional tester for material surface properties were used to characterize the microstructure and mechanical properties of the multilayers. The results indicated a well-defined composition modulation and layer structure of the multilayers. To the multilayers with constant modulation ratio of 15.4:1 and modulation period of 11.8 nm, the multilayer deposited on Al 2 O 3(111) substrate with 38 nm-thick Ti buffer layer at deposition temperature of 225°C revealed the highest hardness (37.4 GPa) and elastic modulus. This hardest multilayer also showed the improved residual stress, friction coefficient, and fracture resistance.


1996 ◽  
Vol 434 ◽  
Author(s):  
H. Ji ◽  
G. S. Was ◽  
J. W. Jones

AbstractMechanical properties of niobium thin films are studied by controlling the microstructure, texture and residual stress of the films using ion beam assisted deposition (IBAD). Niobium films were deposited onto (100) Si substrates and their microstructure, texture and residual stress were measured as a function of ion energy and R ratio (ion to atom arrival rate ratio). The grain sizes of these films ranged from 20 nm to 40 nm and no effect of ion bombardment was observed. All the films have strong (110) fiber texture, but the in-plane texture is a strong function of the incident angle, energy and flux of the ion beam. Results show that while the degree of the texture increases with increasing ion energy and flux, it is also a strong linear function of the product of the two. The residual stress of the films was measured by a scanninglaser reflection technique. As a function of normalized energy, the stress is tensile for En < 30 eV/atom with a maximum of 400 MPa at about 15 eV/atom. It becomes compressive with increasing normalized energy and saturates at - 400 MPa for En > 50 eV/atom. Both PVD (physical vapor deposition) and IBAD films have a hardness of about 6 GPa at shallow depth measured by nanoindentation. The different stress state may be responsible for the 15%difference on hardness observed between the PVD and IBAD films.


1993 ◽  
Vol 308 ◽  
Author(s):  
C. E. Kalnas ◽  
L. J. Parfitt ◽  
M. G. Goldiner ◽  
G. S. Was ◽  
J. W. Jones

ABSTRACTFilms of Al, Al2O3 and Al/Al2O3 microlaminates were formed by ion beam assisted deposition (IBAD) at R ratios from 0.0025 to 0.5 and film thicknesses between 150 and 2600 nm. Oxide films were amorphous while metal layers were crystalline with small grains and texture for both PVD and IBAD conditions. The average stress in the oxide film is tensile at R=0 and becomes compressive, saturating at approximately 15 eV/atom. The residual stress in the Al films is tensile over all R ratios and the stress in the microlaminate roughly follows a rule of mixtures. Deformation of ductile substrates on which films had been deposited revealed that the critical strain to fracture was strongly dependent on residual stress. Large compressive stresses in monolithic films produced by ion beam assisted deposition delayed the onset of crack initiation while the presence of multiple layers, in general, lowered the crack density at saturation, suggesting a possible ductilizing effect.


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