Effects of ion bombardment in plasma etching on the fluorinated silicon surface layer: Real‐time and postplasma surface studies

1993 ◽  
Vol 11 (1) ◽  
pp. 34-46 ◽  
Author(s):  
Gottlieb S. Oehrlein
Keyword(s):  
Surface Layer ◽  
Real Time ◽  
Plasma Etching ◽  
Silicon Surface ◽  
Ion Bombardment ◽  
Surface Studies

Cl2 Plasma Etching of Si(100): Surface Chemistry and Damage

1996 ◽  
Vol 448 ◽  
Author(s):  
N. Layadi ◽  
V. M. Donnelly ◽  
J. T. C. Lee
Keyword(s):  
Surface Layer ◽  
Surface Chemistry ◽  
Real Time ◽  
Plasma Etching ◽  
Spectroscopic Ellipsometry ◽  
Photoelectron Spectroscopy ◽  
Equivalent Thickness ◽  
Ion Energy ◽  
X Ray

AbstractThe interaction of a Cl2 plasma with a Si(100) surface has been investigated by angle resolved x-ray photoelectron spectroscopy (XPS) and spectroscopic ellipsometry. From XPS, it was found that the amount of chlorine incorporated at the Si surface increases with ion energy. Chlorine is present as SiClx (x = 1-3) with average relative coverages (integrated over depth) of [SiCl]:[SiCl2]:[SiCl3] ≅ 1:0.33:0.1. These relative coverages don’t depend strongly on ion energy between 40 and 280 eV. Real-time spectroscopic ellipsometry measurements showed that the layer present during etching is stable when the plasma is extinguished and the gas pumped away. In addition, the equivalent thickness of damaged silicon and silicon-chloride within the surface layer increases with ion energy.

Plasma etching as a diagnostic technique in silicon surface studies

1977 ◽  
Vol 12 (5) ◽  
pp. 1019-1027 ◽  
Author(s):  
D. P. Griffiths ◽  
S. H. Bradley
Keyword(s):  
Plasma Etching ◽  
Silicon Surface ◽  
Diagnostic Technique ◽  
Surface Studies

Surface and Near-Surface Atom Dynamics During Low Energy Xe Ion Bombardment of Si and Fcc Surfaces

1990 ◽  
Vol 193 ◽  
Author(s):  
M. V. R. Murty ◽  
H. S. Lee ◽  
Harry A. Atwater
Keyword(s):  
Molecular Dynamics ◽  
Surface Layer ◽  
Ion Bombardment ◽  
Low Energy ◽  
Surface Processes ◽  
Defect Production ◽  
Near Surface ◽  
Qualitative Nature ◽  
Dynamics Simulations ◽  
Atom Dynamics

ABSTRACTSurface and near-surface processes have been studied during low energy Xe ion bombardment of Si (001) and fcc surfaces using molecular dynamics simulations. Defect production is enhanced near the surface of smooth Si (001) surfaces with respect to the bulk in the energy range 20–150 eV, but is not confined exclusively to the surface layer. The extent and qualitative nature of bombardment-induced dissociation of small fcc islands on an otherwise smooth fcc (001) surface is found to depend strongly on island cohesive energy.

Direct UHV-TEM Observation of Palladium Clusters on a Silicon Surface

2004 ◽  
Vol 10 (1) ◽  
pp. 134-138 ◽  
Author(s):  
Masaki Takeguchi ◽  
Kazutaka Mitsuishi ◽  
Miyoko Tanaka ◽  
Kazuo Furuya
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Surface Layer ◽  
Silicon Surface ◽  
Lattice Structure ◽  
Plan View ◽  
Palladium Clusters ◽  
Transmission Electron ◽  
Pd Clusters

About 1 monolayer of palladium was deposited onto a silicon (111) 7 × 7 surface at a temperature of about 550 K inside an ultrahigh vacuum transmission electron microscope, resulting in formation of Pd2Si nanoislands and a 1 × 1 surface layer. Pd clusters created from an excess of Pd atoms on the 1 × 1 surface layer were directly observed byin situplan view high-resolution transmission electron microscopy. When an objective aperture was introduced so that electron diffractions less than 0.20 nm were filtered out, the lattice structure of the 1 × 1 surface with 0.33 nm spacing and the Pd clusters with a trimer shape were visualized. It was found that image contrast of the 1 × 1 lattice on the specific height terraces disappeared, and thereby an atomic structure of the Pd clusters was clearly observed. The appearance and disappearance of the 1 × 1 lattice was explained by the effect of the kinematical diffraction. It was identified that a Pd cluster was composed of three Pd atoms without a centered Si atom, which is consistent with the model proposed previously. The feature of the Pd clusters stuck at the surface step was also described.

Real-Time Monitoring and Control of Plasma Etching

1998 ◽  
Vol 37 (Part 1, No. 4B) ◽  
pp. 2381-2387 ◽  
Author(s):  
Moshe Sarfaty ◽  
Chris Baum ◽  
Michael Harper ◽  
Noah Hershkowitz ◽  
Juda L. Shohet
Keyword(s):  
Real Time ◽  
Plasma Etching ◽  
Monitoring And Control ◽  
Real Time Monitoring ◽  
And Control

Dry Etch Damage in GaAs P-N Junctions

1991 ◽  
Vol 240 ◽  
Author(s):  
S. J. Pearton ◽  
F. Ren ◽  
C. R. Abernathy ◽  
T. R. Fullowan ◽  
J. R. Lothian
Keyword(s):  
Plasma Etching ◽  
Ion Bombardment ◽  
Plasma Exposure ◽  
Base Resistance ◽  
Ion Energy ◽  
Ion Energies ◽  
A Minor ◽  
P Type ◽  
Dry Etch ◽  
Very High

ABSTRACTGaAs p-n junction mesa-diode structures were fabricated so that both n- and p-type layers could be simultaneously exposed to either O2 or H2 discharges. This simulates the ion bombardment during plasma etching with either CCl2F2/O2 or CH4/H2 mixtures. The samples were exposed to 1 mTorr discharges for period of 1–20 min with DC biases of -25 to -400V on the cathode. For O2 ion bombardment, the collector resistance showed only minor (≤10%) increases for biases up to -200 V and more rapid increases thereafter. In our structure, this indicates that bombardment-induced point defects penetrate at least 500 Å of GaAs for ion energies of ≥200eV. The base resistance displayed only a minor increase (∼10%) over the pre-exposure value even for O+ ion energies of 375 eV, due to the very high doping (1020 cm−3 ) in the base. More significant increases in both collector and base resistances were observed for hydrogen ion bombardment due to hydrogen passivation effects. We will give details of this behaviour as a function of ion energy, plasma exposure time and post-treatment annealing temperature.

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