Incorporation of Al or Hf in atomic layer deposition TiO2 for ternary dielectric gate insulation of InAlN/GaN and AlGaN/GaN metal-insulator-semiconductor-heterojunction structure

2017 ◽  
Vol 35 (1) ◽  
pp. 01B132 ◽  
Author(s):  
Albert Colon ◽  
Liliana Stan ◽  
Ralu Divan ◽  
Junxia Shi
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