scholarly journals Towards a Thermal Moore’s Law

2005 ◽  
Author(s):  
Shankar Krishnan ◽  
Suresh V. Garimella ◽  
Greg M. Chrysler ◽  
Ravi V. Mahajan
Keyword(s):  
Heat Sink ◽  
High Efficiency ◽  
Thermal Design ◽  
Air Cooling ◽  
Thermoelectric Coolers ◽  
Moore’S Law ◽  
Moore's Law ◽  
The Impact ◽  
Power Densities ◽  
Design Power

The thermal design power trends and power densities for present and future microprocessors are investigated. The trends are derived based on Moore’s law and scaling theory. Both active and stand-by power are discussed and accounted for in the calculations. A brief discussion of various leakage power components and their impact on the power density trends is provided. Two different lower limits of heat dissipation for irreversible logic computers are discussed. These are based on the irreversibility of logic to represent one bit of information, and on the distribution of electrons to represent a bit. These limits are found to be two or more orders of magnitude lower than present-day microprocessor thermal design power trends. Further, these trends are compared to the projected trends for the desktop product sector from the International Technology Roadmap for Semiconductors (ITRS). To evaluate the thermal impact of the projected power densities, heat sink thermal resistances are calculated for a given technology target. Based on the heat sink thermal resistance trends, the evolution of an air-cooling limit consistent with Moore’s law is predicted. One viable alternative to air-cooling, i.e., the use of high-efficiency solid-state thermoelectric coolers (TECs), is explored. The impact of different parasitics on the thermoelectric figure of merit (ZT) is quantified.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

scholarly journals The Trend of Different Parameters for Designing Integrated Circuits from 1973 to 2019 and Linked to Moore's Law

2020 ◽  
pp. 16-23 ◽  
Keyword(s):  
Integrated Circuits ◽  
Thermal Design ◽  
Microsoft Excel ◽  
Feature Size ◽  
Moore’S Law ◽  
Moore's Law ◽  
Strong Relation ◽  
And Storage ◽  
Design Power

The number of transistors per chip, feature sizes, frequencies, transistor densities, number of cores, thermal design powers, die areas, and storage capacities of Integrated Circuits (ICs) used for different processing units and memories were collected from various websites from 1973 to 2019 and plotted against year of introduction of ICs in semi-log paper to find the trend with R-squared (R2) value using Microsoft Excel. The R2 values of the trend lines for the above parameters were over 0.922 which indicated that more than 92% of data satisfied the fitting lines except for thermal design power (R2 = 0.7) and die area (R2 = 0.4 to 0.6). It was observed that the growths of transistor counts, transistor densities, frequencies, and thermal design powers for different processing units were growing exponentially and doubled every 16.8 to 24 months from 1973 to 2019 except the growth of thermal design powers (TDP) and frequencies of ICs which were increased up to 2003. After that, the growth of TDP and frequencies are nearly linear up to the present day. The growth of the above parameters for ICs of different memories was a little faster, it was doubled every 14 to 16 months. The feature sizes shrunk 2 times every 18 months. A strong relation was found between feature sizes and transistor densities (R2 = 0.9) and observed that one fold of feature size decreased for the increasing of 2-3 folds of transistor densities. It was observed that different parameters for ICs designing from 1973 to 2019 kept pace with Moore's law. It may be concluded that the decrease of feature size, increasing of transistor count and transistor density in ICs design will follow Moore's law for some more years with the limitation of frequency and power of ICs.

Thermal Performance Evaluation of Friction Stir Welded Flat Plate Heat Sink Using CFD Analysis

2015 ◽  
Vol 787 ◽  
pp. 505-509
Author(s):  
A.K. Lakshminarayanan ◽  
M. Suresh
Keyword(s):  
Flat Plate ◽  
Heat Sink ◽  
High Efficiency ◽  
Base Plate ◽  
Software Tool ◽  
Cover Plate ◽  
Air Cooling ◽  
Cooling Systems ◽  
Plate Heat ◽  
Friction Stir

In an era of compact cooling requirements, where air cooling systems seem to be ineffective and consistently, being replaced by liquid cooled systems, with greater watt density heat energy dissipation. Such cooling systems must work with good quality enabling high efficiency. Hence, an attempt is made to fabricate an aluminum alloy based flat plate heat sink with cover and base plate using friction stir welding. The base plate is machined to obtain channels for fluid flow and the cover plate is fitted in the base plate and welded. Two such configurations of these heat sinks were fabricated with varying channel lengths and number of channels. The flow characteristics of the model for these configurations were analyzed numerically using computational fluid dynamics (CFD) software tool, ANSYS fluent 14.

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Low Temperature Curing - Aqueous Base Developable Photoimageable Dielectric for WLP (Wafer Level Packaging)

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 000986-001015
Author(s):  
Eric Huenger ◽  
Joe Lachowski ◽  
Greg Prokopowicz ◽  
Ray Thibault ◽  
Michael Gallagher ◽  
...  
Keyword(s):  
Low Temperature ◽  
Dielectric Material ◽  
Broad Band ◽  
Dielectric Materials ◽  
Next Generation ◽  
Wafer Level ◽  
Moore’S Law ◽  
Moore's Law ◽  
3D Chip Stacking ◽  
The Impact

As advanced packaging application space evolves and continues to deviate from the conventional shrinkage pathway predicted by Moore's law, material suppliers need to continue to work with OEMs, OSATs and Foundries to identify specific opportunities. One such opportunity continues to present itself in developing new materials to support new platforms for next generation products to support 3D chip stacking and TSV applications. The newer material sets can be established to meet more challenging design requirements associated with the demands, presented by the application from both a physical/lithographical processing and design perspective. Next generation packages requires the development of new dielectric materials that can support both the physical demands of 3D chip stacking and TSV package design aspects while maintaining strengths of the existing material platform. While vertical integration necessitates the use of thinned substrates and its associated integration challenges, there is a continuing need to support horizontal shrinkage typical of the Moore's Law, which pushes the lithography envelope requiring finer pitch and smaller feature resolution capability. This presentation identifies the strategy we have taken and highlights approach taking in the development of low temperature curable photoimageable dielectric materials with enhanced lithographic performance. We will discuss the methodology used to create benzocyclobutene based dielectric material curable at 180 °C and show how lithographic performance can be tuned to allow sub 5 micron via using broad band illumination. Finally we will review the impact of low temperature processing on the mechanical, thermal and electrical properties of this novel photoimageable dielectric material.

CFD Analysis of Thermal Shadowing and Optimization of Heatsinks in 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

2019 ◽  
Author(s):  
Jimil M. Shah ◽  
Ravya Dandamudi ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Thermal Management ◽  
Power Density ◽  
Heat Sink ◽  
Single Phase ◽  
Data Centers ◽  
Air Cooling ◽  
Third Generation ◽  
Dielectric Fluids ◽  
Immersion Cooling ◽  
The Impact

Abstract In today’s networking world, utilization of servers and data centers has been increasing significantly. Increasing demand of processing and storage of data causes a corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling has started to reach its limits due to high-powered processors. To overcome these limitations of air cooling in data centers, liquid immersion cooling methods using different dielectric fluids can be a viable option. Thermal shadowing is an effect in which temperature of a cooling medium increases by carrying heat from one source and results in decreasing its heat carrying capacity due to reduction in the temperature difference between the maximum junction temperature of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of heat sinks with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively for single-phase immersion cooling applications. A parametric study is conducted, and significant savings in the volume of a heat sink have been reported.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

scholarly journals A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Large Scale ◽  
High Efficiency ◽  
Experimental Testing ◽  
Growth Stages ◽  
Air Cooling ◽  
Convection Cooling ◽  
Heat Sink Design

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.

Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions

2017 ◽  
Author(s):  
Devdatta Kulkarni ◽  
Sandeep Ahuja ◽  
Sanjoy Saha
Keyword(s):  
Form Factor ◽  
Boundary Conditions ◽  
High Performance ◽  
Thermal Design ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Increasing Demand ◽  
Performance Computing ◽  
Design Power

Continuously increasing demand for higher compute performance is pushing for improved advanced thermal solutions. In high performance computing (HPC) area, most of the end users deploy some sort of direct or indirect liquid cooling thermal solutions. But for the users who have air cooled data centers and air cooled thermal solutions are challenged to cool next generation higher Thermal Design Power (TDP) processors in the same platform form factor without changing environmental boundary conditions. This paper presents several different advanced air cooled technologies developed to cool high TDP processors in the same form factor and within the same boundary conditions of current generation processor. Comparison of thermal performance using different cooling technologies such as Liquid Assist Air Cooling (LAAC) and Loop Heat Pipe (LHP) are presented in this paper. A case study of Intel’s Knights Landing (KNL) processor is presented to show case the increase in compute performance due to different advanced air cooling technologies.

Experimental and Computational Characterization of a Heat Sink Tester

2007 ◽  
Author(s):  
Aalok Trivedi ◽  
Nikhil Lakhkar ◽  
Madhusudhan Iyengar ◽  
Michael Ellsworth ◽  
Roger Schmidt ◽  
...  
Keyword(s):  
Heat Sink ◽  
Accurate Determination ◽  
Thermal Characterization ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Air Cooling

With the continuing industry trends towards smaller, faster and higher power devices, thermal management continues to be extremely important in the development of electronics. In this era of high heat fluxes, air cooling still remains the primary cooling solution in desktops mainly due to its cost. The primary goal of a good thermal design is to ensure that the chip can function at its rated frequency or speed while maintaining the junction temperature within the specified limit. The first and foremost step in measurement of thermal resistance and hence thermal characterization is accurate determination of junction temperature. Use of heat sinks as a thermal solution is well documented in the literature. Previously, the liquid cooled cold plate tester was studied using a different approach and it was concluded that the uncertainty in heat transfer coefficient was within 8% with errors in appropriate parameters, this result was supported by detailed uncertainty analysis based on Monte-Carlo simulations. However, in that study the tester was tested computationally. In this paper, testing and characterization of a heat sink tester is presented. Heat sinks were tested according to JEDEC JESD 16.1 standard for forced convection. It was observed that the error between computational and experimental values of thermal resistances was 10% for the cases considered.

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