Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
S. W. Ricky Lee ◽  
Fubin Song ◽  
Dongkai Shangguan ◽  
Dennis C. Lau ◽  
...  
Keyword(s):  
Life Prediction ◽  
Ball Grid Array ◽  
Prediction Equation ◽  
Fatigue Life Prediction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn4.0wt%Ag0.5wt%Cu, is proposed in this investigation. The test vehicle consists of a lead-free solder plastic ball grid array (PBGA) package, a lead-free PCB, and lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test vehicle’s isothermal fatigue data. Failure modes and locations of the failed samples are discussed.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

scholarly journals Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Jinhua Mi ◽  
Yan-Feng Li ◽  
Yuan-Jian Yang ◽  
Weiwen Peng ◽  
Hong-Zhong Huang
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Censored Data ◽  
Life Prediction ◽  
Ball Grid Array ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Type I ◽  
Lead Free Solder ◽  
Free Solder

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Dwell Time ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Free Solder

The effects of temperature-cycling dwell-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s lead-free solder joints subjected to various dwell times (namely, 15, 60, and 480 minutes) at peak cycling temperatures (0°C and 100°C).

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