Isothermal Fatigue Tests Of Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints At 60oC

2006 ◽  
Author(s):  
J. Lau ◽  
S.W.R. Lee ◽  
Fubin Song ◽  
D. Lau ◽  
Dongkai Shangguan
Keyword(s):  
Solder Joints ◽  
Ball Grid Array ◽  
Fatigue Tests ◽  
Lead Free ◽  
Lead Free Solder ◽  
Isothermal Fatigue ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
S. W. Ricky Lee ◽  
Fubin Song ◽  
Dongkai Shangguan ◽  
Dennis C. Lau ◽  
...  
Keyword(s):  
Life Prediction ◽  
Ball Grid Array ◽  
Prediction Equation ◽  
Fatigue Life Prediction ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

A new thermal-fatigue life prediction equation for a class of lead-free solder alloys, 95.5wt%Sn4.0wt%Ag0.5wt%Cu, is proposed in this investigation. The test vehicle consists of a lead-free solder plastic ball grid array (PBGA) package, a lead-free PCB, and lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test vehicle’s isothermal fatigue data. Failure modes and locations of the failed samples are discussed.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

2009 ◽  
Vol 38 (12) ◽  
pp. 2702-2711 ◽  
Author(s):  
Bite Zhou ◽  
Thomas R. Bieler ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu
Keyword(s):  
Simple Shear ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints

2008 ◽  
Vol 48 (3) ◽  
pp. 431-437 ◽  
Author(s):  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Do-Seop Kim ◽  
Yusuke Kobayashi ◽  
Jidong Yang ◽  
...  
Keyword(s):  
Fatigue Resistance ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Isothermal Fatigue ◽  
Free Solder

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Walter Dauksher
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Dwell Time ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Free Solder

The effects of temperature-cycling dwell-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s lead-free solder joints subjected to various dwell times (namely, 15, 60, and 480 minutes) at peak cycling temperatures (0°C and 100°C).

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