scholarly journals Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

2014 ◽  
Vol 2014 ◽  
pp. 1-11 ◽  
Author(s):  
Jinhua Mi ◽  
Yan-Feng Li ◽  
Yuan-Jian Yang ◽  
Weiwen Peng ◽  
Hong-Zhong Huang
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Censored Data ◽  
Life Prediction ◽  
Ball Grid Array ◽  
Lead Free ◽  
Microelectronic Packaging ◽  
Type I ◽  
Lead Free Solder ◽  
Free Solder

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.

Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints

2003 ◽  
Author(s):  
N. Islam ◽  
J. C. Suhling ◽  
P. Lall ◽  
T. Shete ◽  
H. S. Gale ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Fatigue Resistance ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Alloy ◽  
Temperature Ranges ◽  
Free Solder

In this study, we have examined the thermal cycling reliability of several lead free chip resistor solder joint configurations. Five sizes of resistors (2512, 1206, 0805, 0603, 0402), 2 temperature ranges (−40 to 125°C and −40 to 150°C), and five different solder types have been examined. The solders include the normal SnAgCu alloy recommended by earlier studies (95.5Sn-3.8Ag-0.7Cu), and several variations that include small percentages of Bismuth and Indium to enhance fatigue resistance. Results have been compared to data for standard 63Sn-37Pb joints.

RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING ACCELERATED LIFE TEST

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4553-4558
Author(s):  
OUK SUB LEE ◽  
NO HOON MYOUNG ◽  
DONG HYEOK KIM ◽  
MAN JAE HUR ◽  
SI WOON HWANG
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Accelerated Life Test ◽  
Lead Free ◽  
Lead Free Solder ◽  
Metal Fatigue ◽  
Mechanical Loads ◽  
Free Solder

The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and cyclically applied mechanical loads cause metal fatigue on the lead-free solder joint which inevitably leads to an electrical discontinuity. In the field application, BGA solder joints experience mechanical loads during temperature changes caused by power up/down events as the result of the CTE (Coefficient of Thermal Expansion) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes at joint area corresponding to through-cracks generated by thermal fatigue were measured. In this way, the failure was defined in terms of anomalous changes in electrical resistance of the joint. Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and evaluated in order to quantitate reliability of solder joint.

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