On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

1999 ◽  
Vol 122 (1) ◽  
pp. 28-33 ◽  
Author(s):  
Jang-hi Im ◽  
Edward O. Shaffer ◽  
Theodore Stokich, ◽  
Andrew Strandjord ◽  
Jack Hetzner ◽  
...  
Keyword(s):  
Thin Film ◽  
Thermal Stability ◽  
Photoelectron Spectroscopy ◽  
Moisture Absorption ◽  
Mechanical Performance ◽  
Adhesion Promoter ◽  
Helium Atmosphere ◽  
Thermally Induced ◽  
Good Thermal Stability ◽  
Substrate Surfaces

This work examines the mechanical performance of thin film coatings from Photosensitive-benzocyclobutene (Photo-BCB) formulations (Cyclotene2 4024, 4026 and 7200), on various substrate surfaces such as Al, Cu, Si, and SiN. The adhesion promoter used was designated AP-3000 and was based on vinyltriacetoxysilane (VTAS), which had been properly hydrolyzed and advanced. Measurement of the interfacial adhesion was performed primarily using the modified Edge Liftoff Test m-ELT. It was found that, by applying the newly developed adhesion promoter, AP-3000, the interfacial energy of Photo-BCB to Al, Cu, Si, and SiN was significantly improved, often approaching the toughness of Photo-BCB, ca. 45 J/m2. The x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) analyses of the delaminated surfaces of the Photo-BCB/Al structure revealed distinct differences in surface roughness and the chemical composition depending on whether or not adhesion promoter was used. Other parameters important for long term stability (e.g., moisture uptake and thermal stability) of Photo-BCB were also measured. The equilibrium moisture content at 84 percent RH in ambient temperature was low, 0.14 wt percent and the thermally induced weight loss at 330°C in helium atmosphere was less than 1 percent/h. The low moisture absorption and good thermal stability, together with the given mechanical toughness and adhesion, allow the Photo-BCB to be widely usable for various microelectronic packaging applications, for up to 40 μm thick build in the case of silicon substrate. [S1043-7398(00)00701-5]

Photoinduced Selective Deposition of Aluminium Thin Film Using Dimethylaluminum Hydride

1991 ◽  
Vol 236 ◽  
Author(s):  
Mitsugu Hanabusa ◽  
Hideki Ouchi ◽  
Kenji Ishida ◽  
Masahiro Kawasaki ◽  
Satoshi Shogen
Keyword(s):  
Thin Film ◽  
Photoelectron Spectroscopy ◽  
Surface Reaction ◽  
Silicon Oxide ◽  
Film Growth ◽  
X Ray ◽  
Etched Silicon ◽  
Substrate Surfaces ◽  
Deuterium Lamp ◽  
Dimethylaluminum Hydride

AbstractAluminum thin film was deposited via a photochemical surface reaction of dimethylaluminum hydride (DMAH) using a deuterium lamp. The period required to initiate the film growth differed with substrate, and making use of this result the film could be grown preferentially on silicon nitride and silicon oxide layers rather than on wet-etched silicon. On the basis of an x-ray photoelectron spectroscopy the observed dependence of photodeposition on substrate surfaces can be attributed to how DMAH is chemisorbed initially.

Pd/SiO2 Organic-Inorganic Hybrid Materials by Sol-Gel Method: Preparation and Thermal Stability under H2 Atmosphere

2015 ◽  
Vol 1118 ◽  
pp. 20-27
Author(s):  
Jing Yang ◽  
Bao Song Li ◽  
Xiang Huo ◽  
Hao Xu ◽  
Hai Yun Hou
Keyword(s):  
Thermal Stability ◽  
Calcination Temperature ◽  
Hybrid Materials ◽  
Photoelectron Spectroscopy ◽  
Sol Gel ◽  
X Ray Diffraction ◽  
Inorganic Hybrid ◽  
X Ray ◽  
Good Thermal Stability ◽  
Pd Doping

Pd/SiO2 organic-inorganic hybrid materials were prepared by adding PdCl2 into methyl-modified silica sol. The Pd/SiO2 hybrid materials were characterized by X-ray diffraction (XRD), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS). The effects of calcination temperature and Pd-doping on the phase transition of Pd element and the thermal stability of CH3 group in the Pd/SiO2 organic-inorganic hybrid materials were investigated. The results showed that the reduced metallic Pd0 exhibits good thermal stability under H2 atmosphere in the calcination process. Pd element in noncalcined Pd/SiO2 materials exists in PdCl2 form, calcination at 200 °C in a H2 atmosphere produces some metallic Pd0 and calcinations at 350 °C results in the complete transformation of Pd2+ to metallic Pd0. With the increase of calcination temperature, the Pd0 particle sizes increase and the hydrophobic Si−CH3 bands decrease in intensity. As the calcination temperature is greater than or equal to 350 °C, the loading of metallic Pd0 nearly has no influence on the chemical structure but, with the increase of Pd content, the formed Pd0 particle size increases. To keep the hydrophobicity of Pd/SiO2 membrane materials, the optimal calcination temperature is about 350 °C under H2 atmosphere.

Thermal Stability of Structurally Controlled Lamellae and Hexagonal Mesoporous Silicate Thin Films

1999 ◽  
Vol 576 ◽  
Author(s):  
I. Honma ◽  
A. Endo ◽  
D. Kundu ◽  
H. S. Zhou
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Structural Changes ◽  
Liquid Interfaces ◽  
Thermally Induced ◽  
One Dimensional ◽  
Mesoporous Silicate ◽  
The Moment ◽  
Substrate Surfaces ◽  
Thermal Stability Of

ABSTRACTThin films of mesoporous materials have been synthesized recently as lamellar, one dimensional hexagonal and cubic structures at substrate surfaces as well as at air/liquid interfaces. The present work investigates thermally induced structural changes of lamellar and one-dimensional hexagonal(1-dH) mesostructured silicate thin films, which is less known at the moment. The 1-dH films proved to be much more thermally stable than the lamellar ones; Open-pore one dimensionalhexagonalmesoporous thin films are obtained by the calcination of the films, where as the lamellarphase has collapsed after the surfactants removal.

scholarly journals Enhanced Corrosion Protection of Iron by Poly(3-hexylthiophene)/Poly(styrene-co-hydroxystyrene) Blends

Coatings ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 383 ◽  
Author(s):  
Ming-Chia Tsai ◽  
Chung-Ru Yang ◽  
Jen-Hao Tsai ◽  
Yuan-Hsiang Yu ◽  
Ping-Tsung Huang
Keyword(s):  
Thermal Stability ◽  
Thermal Treatment ◽  
Adhesion Force ◽  
Hydroxyl Group ◽  
Adhesion Test ◽  
Adhesion Promoter ◽  
Protection Efficiency ◽  
Good Thermal Stability ◽  
Corrosion Of Iron ◽  
Anticorrosion Properties

Corrosion of iron in NaCl solution is significantly reduced by poly(3-hexylthiophene) (P3HT)/poly(styrene-co-hydroxystyrene)(PS-co-PHS) blended coating layers, especially at elevated temperature. The interaction between sulfur (in P3HT) and hydroxyl group (in PS-co-PHS) leads to enhanced miscibility between P3HT and PS-co-PHS and results in improved thermal stability upon thermal treatment. Adhesion force between iron and the coating layer is increased with increasing hydroxystyrene ratio as revealing by the adhesion test (ASTM 3359). Anticorrosion properties from electrochemical experiments indicate great improvement over the P3HT/PS blend. Protection efficiency (PE) of P3HT/PS-co-PHS blend on iron increases and corrosion rate (mils per year, MPY) decreases upon thermal treatment, making P3HT/PS-co-PHS blend an excellent corrosion inhibitor and adhesion promoter material to the iron, especially with good thermal stability.

scholarly journals Synthesis of Eugenol-Based Silicon-Containing Benzoxazines and Their Applications as Bio-Based Organic Coatings

Coatings ◽  
2018 ◽  
Vol 8 (3) ◽  
pp. 88 ◽  
Author(s):  
Jinyue Dai ◽  
Shimin Yang ◽  
Na Teng ◽  
Yuan Liu ◽  
Xiaoqing Liu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Moisture Absorption ◽  
High Hardness ◽  
Resonance Spectroscopy ◽  
Scanning Calorimetry ◽  
Good Thermal Stability ◽  
Chemical Structures ◽  
Ring Opening Reaction ◽  
Ft Ir ◽  
Excellent Adhesion

In this work, several bio-based main-chain type benzoxazine oligomers (MCBO) were synthesized from eugenol derivatives via polycondensation reaction with paraformaldehyde and different diamine. Afterwards, their chemical structures were confirmed by Fourier Transform Infrared Spectroscopy (FT-IR) and Nuclear Magnetic Resonance Spectroscopy (1H-NMR). The curing reaction was monitored by Differential Scanning Calorimetry (DSC) and FT-IR. The polybenzoxazine films were prepared via thermal ring-opening reaction of benzoxazine groups without solvent, and their thermodynamic properties, thermal stability, and coating properties were investigated in detail. Results indicated that the cured films exhibited good thermal stability and mechanical properties, showing 10% thermal weight loss (Td10%) temperature as high as 408 °C and modulus at a room temperature of 2100 MPa as well as the glass transition temperature of 123 °C. In addition, the related coatings exhibited high hardness, excellent adhesion, good flexibility, low moisture absorption, and outstanding solvent resistance.

A Phase Diagram Approach for Predicting Reactions in Al/TiW(-Nitride) Thin-Film Systems

1990 ◽  
Vol 187 ◽  
Author(s):  
A.S. Bhansali ◽  
I.J.M.M. Raaijmakers ◽  
R. Sinclair ◽  
A.E. Morgan ◽  
B.J. Burrow ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Stability ◽  
Phase Diagram ◽  
Reaction Products ◽  
Good Thermal Stability ◽  
Quaternary Phase ◽  
Order Of Magnitude ◽  
Diagram Approach ◽  
Xrd And Tem

AbstractA quaternary phase diagram for Ti–W–N–Al has been calculated from existing thermodynamic data, and is used to predict the Al/TiW-nitride reaction. The predicted reaction products-TiAl3, WAl5, WAl12, and AlN—were observed by XRD and TEM in annealed Al/TiW(-nitride) thin films. The sheet resistance of Al/TiW films increased by an order of magnitude at 550°C, whereas the increase in the case of the Al/TiW-nitride films was not even two-fold. The formation of an interfacial AlN layer was observed in the Al/TiW-nitride metallization. This AlN layer limits the interaction between Al and TiW-nitride, thus providing good thermal stability.

scholarly journals Fabrication of High-Performance Bamboo–Plastic Composites Reinforced by Natural Halloysite Nanotubes

Molecules ◽  
2020 ◽  
Vol 25 (9) ◽  
pp. 2259
Author(s):  
Xiaobei Jin ◽  
Jingpeng Li ◽  
Rong Zhang ◽  
Zehui Jiang ◽  
Daochun Qin
Keyword(s):  
Thermal Stability ◽  
High Performance ◽  
Moisture Absorption ◽  
Mechanical Performance ◽  
Halloysite Nanotubes ◽  
Industrial Applications ◽  
High Concentration ◽  
Morphological Studies ◽  
Plastic Composites ◽  
The Impact

Bamboo-plastic composites (BPCs) as new biomass-plastic composites have recently attracted much attention. However, weak mechanical performance and high moisture absorption as well as low thermal stability greatly limit their industrial applications. In this context, different amounts of halloysite nanotubes (HNTs) were used as a natural reinforcing filler for BPCs. It was found that the thermal stability of BPCs increased with increasing HNT contents. The mechanical strength of BPCs was improved with the increase in HNT loading up to 4 wt% and then worsened, while the impact strengths were slightly reduced. Low HNT content (below 4 wt%) also improved the dynamic thermomechanical properties and reduced the water absorption of the BPCs. Morphological studies confirmed the improved interfacial compatibility of the BPC matrix with 4 wt% HNT loading, and high-concentration HNT loading (above 6 wt%) resulted in easy agglomeration. The results highlight that HNTs could be a feasible candidate as nanoreinforcements for the development of high-performance BPCs.

Thermal Stability and Electrical Properties of Ag(Al) Metallization

2004 ◽  
Vol 812 ◽  
Author(s):  
Hyunchul C. Kim ◽  
N. David Theodore ◽  
James W. Mayer ◽  
Terry L. Alford
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Stability ◽  
Electrical Resistivity ◽  
High Speed ◽  
Rutherford Backscattering Spectrometry ◽  
Al Alloy ◽  
Good Thermal Stability ◽  
Al Thin Film ◽  
Cu Thin Film

AbstractThe thermal stability and electrical resistivity of Ag(Al) alloy thin films on SiO2 are investigated and compared to pure Ag thin films by performing various analyses: Rutherford backscattering spectrometry (RBS), X-ray diffractometry (XRD), transmission electron microscopy (TEM), and four-point probe. The susceptibility to agglomeration of Ag on SiO2 layer is a drawback of Ag metallization. Ag(Al) thin films show good thermal stability on SiO2 layer without any diffusion barrier. The films are stable up to 600 °C for 1 hour in vacuum. Electrical resistivity of as-deposited Ag (5 at % Al) thin film is slightly higher than that of pure Ag thin film. However, the resistivity of Ag(Al) samples annealed at high temperatures (up to 600 °C for 1 hour in vacuum) remains constant due to the improvement of thermal stability (large reduction of agglomeration). This finding can impact metallization for thin film transistors (TFT) for displays, including flexible displays, and high-speed electronics due to lower resistivity value compared to Cu thin film.

Morphologies of Nonadherent Al2O3 and Matching Substrate Surfaces

1972 ◽  
Vol 30 ◽  
pp. 524-525
Author(s):  
C. S. Giggins ◽  
J. K. Tien ◽  
B. H. Kear ◽  
F. S. Pettit
Keyword(s):  
Electron Microscopy ◽  
Oxide Scale ◽  
Oxidation Resistance ◽  
Substrate Surface ◽  
Morphological Features ◽  
Thermally Induced ◽  
Oxide Spallation ◽  
Oxidation Resistant ◽  
Induced Stresses ◽  
Substrate Surfaces

The performance of most oxidation resistant alloys and coatings is markedly improved if the oxide scale strongly adheres to the substrate surface. Consequently, in order to develop alloys and coatings with improved oxidation resistance, it has become necessary to determine the conditions that lead to spallation of oxides from the surfaces of alloys. In what follows, the morphological features of nonadherent Al2O3, and the substrate surfaces from which the Al2O3 has spalled, are presented and related to oxide spallation.The Al2O3, scales were developed by oxidizing Fe-25Cr-4Al (w/o) and Ni-rich Ni3 (Al,Ta) alloys in air at 1200°C. These scales spalled from their substrates upon cooling as a result of thermally induced stresses. The scales and the alloy substrate surfaces were then examined by scanning and replication electron microscopy.The Al2O3, scales from the Fe-Cr-Al contained filamentary protrusions at the oxide-gas interface, Fig. 1(a). In addition, nodules of oxide have been developed such that cavities were formed between the oxide and the substrate, Fig. 1(a).

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