Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
John Janssen ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Boundary Condition ◽  
Thermal Model ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Small Subset ◽  
Electronic Packages ◽  
Detailed Model ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

2009 ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
William Maltz
Keyword(s):  
Boundary Condition ◽  
Design Methodology ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Electronic Packages ◽  
Active Components ◽  
Detailed Model ◽  
Heat Flows ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex optoelectronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Matlab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.

scholarly journals Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2968 ◽  
Author(s):  
Valentin Bissuel ◽  
Frédéric Joly ◽  
Eric Monier-Vinard ◽  
Alain Neveu ◽  
Olivier Daniel
Keyword(s):  
Numerical Model ◽  
Power Distribution ◽  
Thermal Model ◽  
Integrated Design ◽  
Ball Grid Array ◽  
Physical Models ◽  
Maximum Temperature ◽  
Board Structure ◽  
Large Set ◽  
Design Environment

The concept of a single-input/multi-output thermal network was proposed by the Development of Libraries of Physical models for an Integrated design environment (DELPHI) consortium more than twenty years ago. The present work highlights the recent improvements made to efficiently derive a low-computing-effort model from a fully detailed numerical model and to characterize its performances. The temperature predictions of a deduced ball-grid-array (BGA) dynamic compact thermal model are compared to those of a realistic three-dimensional representation, including the large set of internal copper traces, as well as its board structure, which has been validated by experiment. The current study discloses a method for creating an amalgam reduced-order modal model (AROMM) for that electronic component family that allows the preservation of the geometry integrity and shortening scenarios computation. Typically, the AROMM method reduces by a factor of 600 the computation time needed to obtain the solution while keeping the error on the maximum temperature below 2%. Then, a meta-heuristic optimization is run to derive a more practical low-order resistor capacitor model that enables a thermo-fluidic analysis at the board level. Based on the calibrated numerical model, a novel AROMM method was investigated in order to address the chip behavior submitted to multiple heat sources. The first results highlight the capability to enforce a non-uniform power distribution on the upper surface of the silicon chip. Thus, the chip design layout can be analyzed and optimized to prevent thermal and reliability issues.

scholarly journals Extraction of Boundary Condition Independent Dynamic Compact Thermal Models of LEDs—A Delphi4LED Methodology

Energies ◽  
2019 ◽  
Vol 12 (9) ◽  
pp. 1628 ◽  
Author(s):  
Robin Bornoff
Keyword(s):  
Boundary Condition ◽  
Ad Hoc ◽  
Thermal Response ◽  
System Level ◽  
Detailed Model ◽  
Thermal Models ◽  
Level Model ◽  
System Level Model ◽  
Transient Thermal ◽  
Transient Thermal Response

Multi-domain electro-thermal-optical models of LEDs are required so that their thermal and optical behavior may be predicted during a luminaire design process. Today, no standardized approach exists for the extraction of such models. Therefore, models are not readily provided by LED suppliers to end-users. This results in designers of LED-based luminaires wasting time on LED characterization and ad hoc model extraction themselves. The Delphi4LED project aims to address these deficiencies by identifying standardizable methodologies to extract both electro-optical and thermal compact models of LEDs that together can be used in a multi-domain simulation context. This article describes a methodology to extract compact thermal models of LEDs that are dynamic, in that they accommodate transient thermal effects, and are boundary condition-independent, in that their accuracy is independent of their thermal operating environment. Such models are achieved by first proposing an equivalent thermal nodal network topology. The thermal resistances and capacitances of that network are identified by means of optimization so that the transient thermal response of the network matches that of either an equivalent calibrated 3D thermal model or a transient thermal measurement of a physical sample. The accuracy of the thermal network is then verified by comparing the thermal compact model with a 3D detailed model, which predicts thermal responses within a 3D system-level model.

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

2005 ◽  
Vol 127 (1) ◽  
pp. 67-75 ◽  
Author(s):  
Peter Rodgers ◽  
Vale´rie Eveloy ◽  
M. S. J. Hashmi
Keyword(s):  
Thermal Analysis ◽  
Reynolds Number ◽  
Eddy Viscosity ◽  
Predictive Accuracy ◽  
Low Reynolds Number ◽  
Turbulence Models ◽  
Thermal Design ◽  
Junction Temperature ◽  
Temperature Prediction ◽  
Low Reynolds

The flow modeling approaches employed in computational fluid dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated electronic boards. This limitation has been previously highlighted (Eveloy, V. et al., 2004, IEEE Trans. Compon., Packag., Technol. 27, pp. 268–282), with component junction temperature prediction errors of up to 35% reported. This study evaluates the potential of three candidate low-Reynolds number eddy viscosity turbulence models to improve predictive accuracy. An array of fifteen board-mounted PQFPs is analyzed in a 4 m/s airflow. Using the shear stress transport k-ω model, significant improvements in component junction temperature prediction accuracy are obtained relative to the standard high-Reynolds number k-ε model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

Thermal Model of a PC

1994 ◽  
Vol 116 (2) ◽  
pp. 134-137 ◽  
Author(s):  
Ronald L. Linton ◽  
D. Agonafer
Keyword(s):  
Thermal Model ◽  
Control Volume ◽  
Turbulent Viscosity ◽  
Flow Distribution ◽  
Electronic Packages ◽  
Air Flow Rate ◽  
Simulation Code ◽  
Alternative Approach ◽  
Finite Control ◽  
Turbulence Effects

This paper presents an alternative approach to modeling box cooling in electronic packages. A finite-control-volume simulation code is used to simulate an IBM desktop Personal Computer. Only the geometry, the overall air flow rate, the turbulent viscosity and the power dissipations from each card must be specified. The simulation code predicts the flow distribution inside the PC, the convection coefficients, the turbulence effects, and the temperatures. Predicted component temperatures were compared to measured values.

Thermal Analysis of Realistic Breast Model With Tumor and Validation by Infrared Images

2021 ◽  
pp. 208-218
Author(s):  
Deepika Singh ◽  
Ashutosh Kumar Singh ◽  
Sonia Tiwari
Keyword(s):  
Breast Cancer ◽  
Thermal Analysis ◽  
Steady State ◽  
Thermal Model ◽  
Infrared Imaging ◽  
Ductal Carcinoma ◽  
Blood Perfusion ◽  
Breast Cancer Detection ◽  
Surface Geometry ◽  
Breast Thermography

Breast thermography is an emerging adjunct tool to mammography in early breast cancer detection due to its non-invasiveness and safety. Steady-state infrared imaging proves promising in this field as it is not affected by tissue density. The main aim of the present study is to develop a computational thermal model of breast cancer using real breast surface geometry and internal tumor specification. The model depicting the thermal profile of the subject's aggressive ductal carcinoma is calibrated by variation of blood perfusion and metabolic heat generation rate. The subject's IR image is used for validation of the simulated temperature profile. The thermal breast model presented here may prove useful in monitoring the response of tumor post-chemotherapy for female subjects with similar breast cancer characteristics.

Thermal Analysis of Heating System in Thermosonic Bonding Process

2013 ◽  
Vol 300-301 ◽  
pp. 794-801
Author(s):  
Lu Fan Zhang ◽  
Xue Li Li ◽  
Ji Wen Fang ◽  
Jian Dong Cai ◽  
Long Sheng Nian ◽  
...  
Keyword(s):  
Finite Element Method ◽  
Thermal Analysis ◽  
Thermal Stress ◽  
Thermal Model ◽  
Reference Value ◽  
Heating System ◽  
Bonding Process ◽  
Thermal Displacement ◽  
Process Heating ◽  
Thermal Stress Distribution

A constant temperature range of the heating system plays an important role in the thermosonic bonding process. Heating block will provide enough heat for the heating system. In the paper, the thermal model of heating block and heating system were calculated by finite element method, and then some important conclusions were obtained. The change of temperature and thermal stress of block with the reference value of x and y was obtained. And an optimal structure of block for right temperature was built. The temperature distribution, thermal displacement and thermal stress distribution of the heating block and heating system were disclosed. The relevant change trends of temperature and thermal stress under the different load of temperature were investigated. These results can help improve the reliability of the heating system used in the thermosonic bonding process.

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