scholarly journals Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2968 ◽  
Author(s):  
Valentin Bissuel ◽  
Frédéric Joly ◽  
Eric Monier-Vinard ◽  
Alain Neveu ◽  
Olivier Daniel
Keyword(s):  
Numerical Model ◽  
Power Distribution ◽  
Thermal Model ◽  
Integrated Design ◽  
Ball Grid Array ◽  
Physical Models ◽  
Maximum Temperature ◽  
Board Structure ◽  
Large Set ◽  
Design Environment

The concept of a single-input/multi-output thermal network was proposed by the Development of Libraries of Physical models for an Integrated design environment (DELPHI) consortium more than twenty years ago. The present work highlights the recent improvements made to efficiently derive a low-computing-effort model from a fully detailed numerical model and to characterize its performances. The temperature predictions of a deduced ball-grid-array (BGA) dynamic compact thermal model are compared to those of a realistic three-dimensional representation, including the large set of internal copper traces, as well as its board structure, which has been validated by experiment. The current study discloses a method for creating an amalgam reduced-order modal model (AROMM) for that electronic component family that allows the preservation of the geometry integrity and shortening scenarios computation. Typically, the AROMM method reduces by a factor of 600 the computation time needed to obtain the solution while keeping the error on the maximum temperature below 2%. Then, a meta-heuristic optimization is run to derive a more practical low-order resistor capacitor model that enables a thermo-fluidic analysis at the board level. Based on the calibrated numerical model, a novel AROMM method was investigated in order to address the chip behavior submitted to multiple heat sources. The first results highlight the capability to enforce a non-uniform power distribution on the upper surface of the silicon chip. Thus, the chip design layout can be analyzed and optimized to prevent thermal and reliability issues.

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
John Janssen ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Boundary Condition ◽  
Thermal Model ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Small Subset ◽  
Electronic Packages ◽  
Detailed Model ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.

scholarly journals Temperature Distribution of HBC Fuses with Asymmetric Electric Current Ratios Through Fuselinks

Energies ◽  
2018 ◽  
Vol 11 (8) ◽  
pp. 1990
Author(s):  
Adrian Plesca
Keyword(s):  
Electric Current ◽  
Cross Section ◽  
Power Distribution ◽  
Thermal Model ◽  
3D Model ◽  
Industrial Applications ◽  
Experimental Simulation ◽  
Maximum Temperature ◽  
Power Distribution Network ◽  
Thermal Distribution

In many industrial applications high breaking capacity (HBC) fuses are used to protect electrical installations against overcurrents, especially in the power distribution network. At high rated current, HBC fuses have more parallel fuselinks mounted inside. The technological and mounting processes of the fuselinks inside the fuse results in an asymmetrical current distribution through the parallel fuselinks. In this article a model of a high breaking capacity fuse using two parallel fuselinks is proposed. The influence of electric current, cross-section of the notches, distance between notches and current imbalance through fuselinks on the maximum temperature rise of both fuselinks, has been investigated. Also, a 3D thermal model for the same HBC fuse has been developed. The temperature spread into the fuse and its elements has been obtained. In order to prove the validity of the mathematical and 3D model different tests have been considered. The experimental, simulation and computed results give similar values and it results that this model can also be used for fuses with many parallel fuselinks and it permits the design of new fuse elements with optimal thermal distribution.

Optimization of the Case Depth of a Cylinder Made With 4340 Steel by a Control of the Laser Heat Treatment Parameters

2018 ◽  
Author(s):  
Rachid Fakir ◽  
Noureddine Barka ◽  
Jean Brousseau
Keyword(s):  
Heat Treatment ◽  
Numerical Model ◽  
Surface Temperature ◽  
Laser Power ◽  
Case Depth ◽  
Maximum Temperature ◽  
Laser Heat Treatment ◽  
Laser Heat ◽  
4340 Steel ◽  
Cylindrical Workpiece

This paper presents a numerical model able to control the temperature distribution along a 4340 steel cylinder heat-treated with Nd: YAG laser. The numerical model developed using the numerical finite element method, was based on a study of surface temperature variation and the adjustment of this temperature by a control of the heat treatment laser power. The proposed analytical approach was built gradually by (i) the development of a numerical model of laser heat treatment of the cylindrical workpiece, (ii) an analysis of the results of simulations and experimental tests, (iii) development of a laser power adjustment approach, and (iv) proposal of a laser power control predictor using neural networks. This approach was made possible by highlighting the influence of the fixed (non-variable) parameters of the laser heat treatment on the case depth, and has shown that it is possible by controlling the laser parameters to homogenize the distribution of the maximum temperature reached on the surface for a uniform case depth. The feasibility and effectiveness of the proposed approach leads to a reliable and accurate model able to guarantee a uniform surface temperature and a regular case depth for a cylindrical workpiece of a length of 50-mm and with a diameter of between 16-mm and 22-mm.

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