Sea of leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)

2003 ◽  
Vol 50 (10) ◽  
pp. 2039-2048 ◽  
Author(s):  
M.S. Bakir ◽  
H.A. Reed ◽  
H.D. Thacker ◽  
C.S. Patel ◽  
P.A. Kohl ◽  
...  
Keyword(s):  
Input Output ◽  
Wafer Level ◽  
Gigascale Integration ◽  
Ultrahigh Density

Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties

2021 ◽  
Vol 21 (5) ◽  
pp. 2987-2991
Author(s):  
Geumtaek Kim ◽  
Daeil Kwon
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Material Properties ◽  
Coefficient Of Thermal Expansion ◽  
Input Output ◽  
Wafer Level ◽  
High Input ◽  
Element Analysis ◽  
Packaging Process ◽  
Wafer Level Packaging

Along with the reduction in semiconductor chip size and enhanced performance of electronic devices, high input/output density is a desired factor in the electronics industry. To satisfy the high input/output density, fan-out wafer-level packaging has attracted significant attention. While fan-out wafer-level packaging has several advantages, such as lower thickness and better thermal resistance, warpage is one of the major challenges of the fan-out wafer-level packaging process to be minimized. There have been many studies investigating the effects of material properties and package design on warpage using finite element analysis. Current warpage simulations using finite element analysis have been routinely conducted with deterministic input parameters, although the parameter values are uncertain from the manufacturing point of view. This assumption may lead to a gap between the simulation and the field results. This paper presents an uncertainty analysis of wafer warpage in fan-out wafer-level packaging by using finite element analysis. Coefficient of thermal expansion of silicon is considered as a parameter with uncertainty. The warpage and the von Mises stress are calculated and compared with and without uncertainty.

Chip-to-Module Interconnections Using “Sea of Leads” Technology

MRS Bulletin ◽  
2003 ◽  
Vol 28 (1) ◽  
pp. 61-67 ◽  
Author(s):  
Muhannad S. Bakir ◽  
Hollie A. Reed ◽  
Anthony V. Mulé ◽  
Joseph Paul Jayachandran ◽  
Paul A. Kohl ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Optical Interconnects ◽  
High Performance ◽  
Index Of Refraction ◽  
Wafer Level ◽  
Enabling Technology ◽  
Air Gaps ◽  
The Core ◽  
Mechanical Compliance ◽  
Ultrahigh Density

AbstractThe drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 104 leads per cm2), compliant, wafer-level, input/output interconnection technology called “sea of leads” as a key enabling technology for future high-performance microsystems. The mechanical compliance is addressed through slippery leads (leads released from the surface) and embedded air gaps. The ability to fabricate embedded air gaps has enabled the integration of optical interconnects with high index-of-refraction mismatches between the core and cladding.

ULTRAHIGH DENSITY VLSI INNER PRODUCT COMPUTATIONS

1996 ◽  
Vol 06 (05) ◽  
pp. 537-546 ◽  
Author(s):  
HOWARD CARD
Keyword(s):  
Power Dissipation ◽  
Cmos Technology ◽  
Inner Product ◽  
Input Output ◽  
Feature Size ◽  
Matrix Computations ◽  
Minimum Feature Size ◽  
Array Multipliers ◽  
Ultrahigh Density ◽  
Regular Networks

This paper discusses some of the limitations to matrix computations performed by special-purpose VLSI systems on a chip as the minimum feature size of CMOS technology is reduced to below 1.0 µ m . Limits to computation rates are imposed by power dissipation and by having a maximum number of pins or input/output ports on the package. The analysis applies to regular networks of array multipliers performing binary integer arithmetic at various bit precisions.

Input-Output in Personnel Management

1970 ◽  
Vol 15 (2) ◽  
pp. 115, 118
Author(s):  
WILLIAM E. COLEMAN
Keyword(s):  
Personnel Management ◽  
Input Output

Adaptive Control Scheme for Coupled Tank Process

2018 ◽  
pp. 89-95
Author(s):  
Vinodhini M.
Keyword(s):  
Adaptive Control ◽  
Nonlinear Behaviour ◽  
Simulation Studies ◽  
Input Output ◽  
Control Scheme ◽  
Direct Model ◽  
Multivariable Process ◽  
Model Reference Adaptive ◽  
Siso System ◽  
Adaptive Control Scheme

The objective of this paper is to develop a Direct Model Reference Adaptive Control (DMRAC) algorithm for a MIMO process by extending the MIT rule adopted for a SISO system. The controller thus developed is implemented on Laboratory interacting coupled tank process through simulation. This can be regarded as the relevant process control in petrol and chemical industries. These industries involve controlling the liquid level and the flow rate in the presence of nonlinearity and disturbance which justifies the use of adaptive techniques such as DMRAC control scheme. For this purpose, mathematical models are obtained for each of the input-output combinations using white box approach and the respective controllers are developed. A detailed analysis on the performance of the chosen process with these controllers is carried out. Simulation studies reveal the effectiveness of proposed controller for multivariable process that exhibits nonlinear behaviour.

Sign in / Sign up

Export Citation Format

Share Document