Electromigration Feedback Controlled Nanogaps Fabrication Based on MPTMS Adhesion Layer

2008 ◽  
Author(s):  
Pierluigi Civera ◽  
Danilo Demarchi ◽  
Gianluca Piccinini ◽  
Matteo Cocuzza ◽  
Denis Perrone
Keyword(s):  
Adhesion Layer

PEALD of a Ruthenium Adhesion Layer for Copper Interconnects

2004 ◽  
Vol 151 (12) ◽  
pp. C753 ◽  
Author(s):  
Oh-Kyum Kwon ◽  
Se-Hun Kwon ◽  
Hyoung-Sang Park ◽  
Sang-Won Kang
Keyword(s):  
Copper Interconnects ◽  
Adhesion Layer

Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post-treatments and the use of Ti adhesion layer

2014 ◽  
Vol 34 ◽  
pp. 446-454 ◽  
Author(s):  
Tomi Laurila ◽  
Antti Rautiainen ◽  
Sakari Sintonen ◽  
Hua Jiang ◽  
Emilia Kaivosoja ◽  
...  
Keyword(s):  
Thin Film ◽  
Diamond Like Carbon ◽  
Adhesion Layer

Crucial Role of the Adhesion Layer on the Plasmonic Fluorescence Enhancement

ACS Nano ◽  
2009 ◽  
Vol 3 (7) ◽  
pp. 2043-2048 ◽  
Author(s):  
Heykel Aouani ◽  
Jérôme Wenger ◽  
Davy Gérard ◽  
Hervé Rigneault ◽  
Eloïse Devaux ◽  
...  
Keyword(s):  
Crucial Role ◽  
Fluorescence Enhancement ◽  
Adhesion Layer

A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer

2015 ◽  
Vol 2015 (1) ◽  
pp. 000365-000369 ◽  
Author(s):  
Zhiming Liu ◽  
Sara Hunegnaw ◽  
Hailuo Fu ◽  
Jun Wang ◽  
Tafadzwa Magaya ◽  
...  
Keyword(s):  
Metal Oxide ◽  
High Frequency ◽  
Metal Layer ◽  
Flat Glass ◽  
Adhesive Layer ◽  
Adhesion Layer ◽  
Coating Solution ◽  
Glass Substrates ◽  
Oxide Precursor ◽  
Oxide Adhesion

Inorganic interposers made of glass are attractive for advanced high frequency applications and ultra- fine line patterning technology. Because glass combines a couple of benefits like large form factor, good coefficient of thermal expansion (CTE) matching to silicon, smooth surface and a low dielectric constant and loss tangent. Recently much progress has been made with respect to glass electrical and physical properties. This allows for handling of thin glass sheets down to 100 μm in a typical PCB panel format. Also advances have been made in the area of laser drilling allowing aspect ratio up to 1:10 for 25 μm diameter of through glass via (TGV). Another major challenge is the cost competitive and reliable metallization of smooth glass, a critical prerequisite for the use of glass substrates in the electronic packaging market. Plated copper does not adhere directly to glass. Sputtering technology typically also requires a 50 nm thick adhesion promoting metal layer (like Ti) before copper can be seeded. This metal layer could not be etched together with the copper and needs to be removed between traces by etching in an additional step. A volatile flammable solvent based metal oxide precursor coating solution has been used to make an adhesive metal oxide layer by a modified sol-gel process. To prevent potential safety issue for mass production water based metal oxide precursor coating solution so called VitroCoat GI W has been developed. The VitroCoat GI W solution can be dip-coated on flat glass surface and TGVs followed by sintering to form an ultrathin metal oxide adhesion layer (about 10nm). The thin adhesive layer enables electroless and electrolytic copper plating directly onto glass substrates without changing any of the glass properties or impacting high frequency performance. The thin metal oxide adhesive layer is non-conductive and can be easily removed from the area between circuit traces. This paper will focus on the coating uniformity and capability of VitroCoat GI W on flat glass surface and TGVs and the adhesion of wet chemical metallization on glass interposer. This adhesion layer can be used for copper fine line patterning on glass and radio frequency (RF) device fabrication.

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