Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition

2005 ◽  
Vol 23 (3) ◽  
pp. 979 ◽  
Author(s):  
Akira Furuya ◽  
Hiroshi Tsuda ◽  
Shinichi Ogawa
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Adhesion Layer ◽  
Cu Interconnects ◽  
Layer Deposition

Atomic Layer Deposition of Ru for Replacing Cu-Interconnects

2021 ◽  
Author(s):  
Yohei Kotsugi ◽  
Seung-Min Han ◽  
Youn-Hye Kim ◽  
Taehoon Cheon ◽  
Dip K. Nandi ◽  
...  
Keyword(s):  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Cu Interconnects ◽  
Layer Deposition

Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer

2011 ◽  
Vol 205 (21-22) ◽  
pp. 5009-5013 ◽  
Author(s):  
Seong-Jun Jeong ◽  
Yu-Ri Shin ◽  
Won-Sub Kwack ◽  
Hyung Woo Lee ◽  
Young-Keun Jeong ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Layer Deposition ◽  
Atomic Layer ◽  
Adhesion Layer ◽  
Layer Deposition
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