Total Ionizing Dose Effects of 1 Mb RfO2-based Resistive-Random-Access-Memory

2018 ◽  
Author(s):  
Jinshun Bi ◽  
Yuan Duan ◽  
Feng Zhang ◽  
Ming Liu
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Total Ionizing Dose ◽  
Access Memory ◽  
Dose Effects ◽  
Total Ionizing Dose Effects

Analysis of Total Ionizing Dose Effects on a Pseudo-Static Random Access Memory (PSRAM)

2012 ◽  
Vol 49 (1) ◽  
pp. 69-76
Author(s):  
T. H. Both ◽  
G. I. Wirth ◽  
E. C. F. Pereira Junior ◽  
O. L. Goncalez ◽  
R. G. Vaz ◽  
...  
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Static Random Access Memory ◽  
Total Ionizing Dose ◽  
Access Memory ◽  
Dose Effects ◽  
Total Ionizing Dose Effects

scholarly journals Total ionizing dose effects on innovative silicon-on-insulator static random access memory cell

2019 ◽  
Vol 68 (16) ◽  
pp. 168501
Author(s):  
Shuo Wang ◽  
Yong-Wei Chang ◽  
Jing Chen ◽  
Ben-Yan Wang ◽  
Wei-Wei He ◽  
...  
Keyword(s):  
Random Access ◽  
Memory Cell ◽  
Random Access Memory ◽  
Silicon On Insulator ◽  
Static Random Access Memory ◽  
Total Ionizing Dose ◽  
Access Memory ◽  
Dose Effects ◽  
Total Ionizing Dose Effects

Total ionizing dose effect of γ-ray radiation on the switching characteristics and filament stability of HfOx resistive random access memory

2014 ◽  
Vol 104 (18) ◽  
pp. 183507 ◽  
Author(s):  
Runchen Fang ◽  
Yago Gonzalez Velo ◽  
Wenhao Chen ◽  
Keith E. Holbert ◽  
Michael N. Kozicki ◽  
...  
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Dose Effect ◽  
Total Ionizing Dose ◽  
Access Memory ◽  
Γ Ray ◽  
Switching Characteristics

scholarly journals Study of total ionizing dose induced read bit errors in magneto-resistive random access memory

2016 ◽  
Vol 67 ◽  
pp. 104-110 ◽  
Author(s):  
Haohao Zhang ◽  
Jinshun Bi ◽  
Haibin Wang ◽  
Hongyang Hu ◽  
Jin Li ◽  
...  
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Total Ionizing Dose ◽  
Access Memory

Effect of Conductive Filament Temperature on ZrO2 based Resistive Random Access Memory Devices

2020 ◽  
Vol 12 (2) ◽  
pp. 02008-1-02008-4
Author(s):  
Pramod J. Patil ◽  
◽  
Namita A. Ahir ◽  
Suhas Yadav ◽  
Chetan C. Revadekar ◽  
...  
Keyword(s):  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Memory Devices ◽  
Access Memory ◽  
Conductive Filament ◽  
Filament Temperature

scholarly journals Improved Device Distribution in High-Performance SiNx Resistive Random Access Memory via Arsenic Ion Implantation

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1401
Author(s):  
Te Jui Yen ◽  
Albert Chin ◽  
Vladimir Gritsenko
Keyword(s):  
High Performance ◽  
Conduction Mechanism ◽  
Random Access ◽  
Random Access Memory ◽  
Resistive Random Access Memory ◽  
Switching Behavior ◽  
Access Memory ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
Limited Conduction

Large device variation is a fundamental challenge for resistive random access memory (RRAM) array circuit. Improved device-to-device distributions of set and reset voltages in a SiNx RRAM device is realized via arsenic ion (As+) implantation. Besides, the As+-implanted SiNx RRAM device exhibits much tighter cycle-to-cycle distribution than the nonimplanted device. The As+-implanted SiNx device further exhibits excellent performance, which shows high stability and a large 1.73 × 103 resistance window at 85 °C retention for 104 s, and a large 103 resistance window after 105 cycles of the pulsed endurance test. The current–voltage characteristics of high- and low-resistance states were both analyzed as space-charge-limited conduction mechanism. From the simulated defect distribution in the SiNx layer, a microscopic model was established, and the formation and rupture of defect-conductive paths were proposed for the resistance switching behavior. Therefore, the reason for such high device performance can be attributed to the sufficient defects created by As+ implantation that leads to low forming and operation power.

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