First-principles study of resistive random access memory based on single-layer black phosphorous resistive layer

2020 ◽  
Vol 128 (21) ◽  
pp. 215702
Author(s):  
Yuehua Dai ◽  
Jianhua Gao ◽  
Lihua Huang ◽  
Renjie Ding ◽  
Peng Wang ◽  
...  
2021 ◽  
Author(s):  
Napolean A ◽  
Sivamangai NM ◽  
Nithya N ◽  
Naveenkumar R

Abstract Metal oxide resistive random access memory (RRAM) is a novel device that provides an alternate solution for existing CMOS memory devices. In RRAM, correlate the experimental result with a simulated result by a unique model is a critical task. This work focused on the validation of silicon substrate-based fabricated single layer annealed and electroformed at 80oC ambient temperature (A-80) RRAM cell. The experimental result concludes that the proposed Pt/HfO2/Pt device provides the forming voltage of 3.8 V, Vset = 1.7 V, and Vreset=-0.8 V. Switching results are compared with the simulated result which is working based on non-linear ion drift, Yakopcic and voltage threshold adaptive memristor (VTEAM) models. VTEAM model gives a closure relationship with experimental data and well suited for our fabricated device. Further, the VTEAM model is modified to contribute accurate results and one of the standard model metrics, accuracy is analysed for a modified VTEAM model. Statistical analysis proves that, the mean error percentage of modified VTEAM and VTEAM models against experimental outcomes are 21.4% and 25.3 % respectively


2016 ◽  
Vol 26 (12) ◽  
pp. 2016-2024 ◽  
Author(s):  
Chunxue Hao ◽  
Fusheng Wen ◽  
Jianyong Xiang ◽  
Shijun Yuan ◽  
Bingchao Yang ◽  
...  

Nanoscale ◽  
2021 ◽  
Author(s):  
Tariq Aziz ◽  
Shi-Jing Wei ◽  
Yun Sun ◽  
Lai-Peng Ma ◽  
Songfeng Pei ◽  
...  

The conventional strategy of fabricating resistive random access memory (RRAM) based on graphene oxide is limited to a resistive layer with homogeneous oxidation, and the switching behavior relies on its...


MRS Advances ◽  
2016 ◽  
Vol 1 (49) ◽  
pp. 3367-3372 ◽  
Author(s):  
Takumi Moriyama ◽  
Takahiro Yamasaki ◽  
Takahisa Ohno ◽  
Satoru Kishida ◽  
Kentaro Kinoshita

ABSTRACTFor practical use of Resistive Random Access Memory (ReRAM), understanding resistive switching mechanism in transition metal oxides (TMO) is important. Some papers predict its mechanism by using first principles calculation; for example, TMO become conductive by introducing oxygen vacancy in bulk single crystalline TMO. However, most of ReRAM samples have polycrystalline structures. In this paper, we introduced a periodic slab model to depict grain boundary and calculated the surface energy and density of states for surfaces of NiO with various orientations using first-principles calculation to consider the effect of grain boundaries for resistive switching mechanisms of ReRAM. As a results, vacancies can be formed on the side surface of grain more easily than in grain. Moreover, we showed that surface conductivity depends on surface orientation of NiO and the orientation of side surface of grain can change easily by introduction of vacancies, which is the switching mechanism of NiO-ReRAM


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