Alternative FIB cross section and laser ablation methods to improve failure analysis throughput of copper wire moisture related reliability failures

2012 ◽  
Author(s):  
W. F. Kho ◽  
J. L. Leow ◽  
Y. C. Cheah ◽  
Y. W. Cheah
Keyword(s):  
Laser Ablation ◽  
Failure Analysis ◽  
Cross Section ◽  
Copper Wire

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Failure Modes, Reliability Analysis and Case Studies on the Integration of Copper and Low-K Technology

2004 ◽  
Author(s):  
Huixian Wu ◽  
James Cargo ◽  
Huixian Wu ◽  
Marvin White
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
Cross Section ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Copper Interconnects ◽  
Wet Chemical ◽  
Low K ◽  
Section Analysis

Abstract The integration of copper interconnects and low-K dielectrics will present novel failure modes and reliability issues to failure analysts. This paper discusses failure modes related to Cu/low-K technology. Here, physical failure analysis (FA) techniques including deprocessing and cross-section analysis have been developed. The deprocessing techniques include wet chemical etching, reactive ion etching, chemical mechanical polishing and a combination of these techniques. Case studies on different failure modes related to Cu/low k technology are discussed: copper voiding, copper extrusion; electromigration stress failure; dielectric cracks; delamination-interface adhesion; and FA on circuit-under-pad. For the cross-section analysis of copper/low-K samples, focused ion beam techniques have been developed. Scanning electron microscopy, EDX, and TEM analytical analysis have been used for failure analysis for Cu/low-K technology. Various failure modes and reliability issues have also been addressed.

Cross-Section Sample Preparation Method for Imaging Dopant Related Anomalies Using Scanning Probe Microscopy Techniques

2014 ◽  
Author(s):  
Swaminathan Subramanian ◽  
Khiem Ly ◽  
Tony Chrastecky
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Cross Section ◽  
Scanning Probe Microscopy ◽  
Preparation Method ◽  
Fault Isolation ◽  
Scanning Probe ◽  
Sample Preparation Method ◽  
Probe Microscopy ◽  
Section Sample

Abstract Visualization of dopant related anomalies in integrated circuits is extremely challenging. Cleaving of the die may not be possible in practical failure analysis situations that require extensive electrical fault isolation, where the failing die can be submitted of scanning probe microscopy analysis in various states such as partially depackaged die, backside thinned die, and so on. In advanced technologies, the circuit orientation in the wafer may not align with preferred crystallographic direction for cleaving the silicon or other substrates. In order to overcome these issues, a focused ion beam lift-out based approach for site-specific cross-section sample preparation is developed in this work. A directional mechanical polishing procedure to produce smooth damage-free surface for junction profiling is also implemented. Two failure analysis applications of the sample preparation method to visualize junction anomalies using scanning microwave microscopy are also discussed.

Mechanical Properties and Failure Analysis of 3D-Woven Copper Wire/Glass Fiber Hybrid Composites

2020 ◽  
Vol 7 (5) ◽  
pp. 17-24
Author(s):  
Fujun Xu ◽  
Liangang Zheng ◽  
Kun Zhang ◽  
Mohamed Amine Aouraghe ◽  
Sidra Saleemi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Failure Analysis ◽  
Glass Fiber ◽  
Structural Integrity ◽  
Bending Strength ◽  
Hybrid Composites ◽  
Copper Wire ◽  
Impact Resistance ◽  
Woven Fabrics ◽  
Woven Composites

Three-dimensional woven fabrics with excellent structural integrity are a very promising structure for multifunctional materials hybridized with various yarns. To systematically investigate mechanical properties and failure analysis of 3D-woven hybrid composites, copper wire/glass fiber composites with two hybrid structures, single-face copper wire (SF-CW) and double-face copper wire (DF-CW), were fabricated and tested. The SF-CW hybrid composites showed excellent tensile strength (1214 MPa) and bending strength (964 MP), which was greater than that of the DF-CW hybrid composites. Additionally, the compression strength and impact resistance of both composites exhibited comparable properties with traditional materials. Furthermore, all failure cross sections showed superior structural integrity and anti-delaminate properties, demonstrating that 3D-woven composites can be a good candidate platform by hybridization with various multifunctional yarns.

Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

2011 ◽  
Vol 51 (1) ◽  
pp. 157-165 ◽  
Author(s):  
Y.H. Tian ◽  
C.J. Hang ◽  
C.Q. Wang ◽  
G.Q. Ouyang ◽  
D.S. Yang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Wire Bonds ◽  
Fine Copper

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

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