Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound

2011 ◽  
Vol 51 (1) ◽  
pp. 157-165 ◽  
Author(s):  
Y.H. Tian ◽  
C.J. Hang ◽  
C.Q. Wang ◽  
G.Q. Ouyang ◽  
D.S. Yang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Wire Bonds ◽  
Fine Copper

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

Warpage Control Method in Epoxy Molding Compound

2020 ◽  
Author(s):  
Wei Tan ◽  
Cheng Cheng ◽  
Hongjie Liu ◽  
Yangyang Duan ◽  
Linlin Liu ◽  
...  
Keyword(s):  
Control Method ◽  
Epoxy Molding Compound ◽  
Molding Compound

Explosively Driven Expansion and Fragmentation Behavior for Cylinders, Spheres and Rings of 304 Stainless Steel

2010 ◽  
Vol 638-642 ◽  
pp. 1035-1040 ◽  
Author(s):  
Tetsuyuki Hiroe ◽  
Kazuhito Fujiwara ◽  
Hidehiro Hata ◽  
Mitsuru Yamauchi ◽  
Kiyotaka Tsutsumi ◽  
...  
Keyword(s):  
Stainless Steel ◽  
High Speed ◽  
Fracture Behavior ◽  
Copper Wire ◽  
304 Stainless Steel ◽  
Fragmentation Model ◽  
Fragmentation Behavior ◽  
Deformation And Fracture ◽  
Test Parameters ◽  
Fine Copper

Explosive loading techniques are applied to expand tubular cylinders, spherical shells and rings of 304 stainless steel to fragmentation, and the effects of wall thicknesses, explosive driver diameters and the constant proportionality of the in-plane biaxial stretching rates are investigated on the deformation and fracture behavior of three basic structures experimentally and numerically. In the cylinder tests, the driver is a column of high explosive PETN, inserted coaxially into the bore of a cylinder and initiated by exploding a fine wire bundle at the column axis using a discharge current from a high-voltage capacitor bank. In case of the ring tests, ring specimens are placed onto a single cylinder filled with the PETN as a expansion driver, and for sphere tests, specimens filled with the PETN are also initiated by exploding a fine copper wire line with small length located at the central point. Two types of experiments are conducted for every specimen and test condition. The first type uses high speed cameras to observe the deformation and crack generation of expanding specimens showing the final maximum in-plane stretching rate of above , and the second uses soft capturing system recovering typically most fragments successfully. The fragments are measured and investigated using a fragmentation model. The effects of test parameters on the deformation and fracture behavior for three types of structures are discussed in need of modified fragmentation model for shell structural elements.

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