Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

2004 ◽  
Author(s):  
Chih Hang Tung ◽  
Poi Siong Teo ◽  
C. Lee
Keyword(s):  
High Temperature ◽  
Microstructure Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interface Microstructure ◽  
High Temperature Storage ◽  
Free Solder ◽  
Temperature Storage

Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder

2020 ◽  
Vol 49 (4) ◽  
pp. 2660-2668 ◽  
Author(s):  
Jianglei Fan ◽  
Hengtao Zhai ◽  
Zhanyun Liu ◽  
Xiao Wang ◽  
Xiangkui Zhou ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Microstructure Evolution ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Wetting and interface microstructure between Sn–Zn binary alloys and Cu

1998 ◽  
Vol 13 (10) ◽  
pp. 2859-2865 ◽  
Author(s):  
Katsuaki Suganuma ◽  
Koichi Niihara ◽  
Takeshi Shoutoku ◽  
Yoshikazu Nakamura
Keyword(s):  
Tensile Strength ◽  
Binary Alloys ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interface Microstructure ◽  
Free Solder ◽  
Rigid Interface ◽  
Liquidus Temperatures

Sn–Zn binary alloys have been examined as a lead-free solder. Zn distributes in a Sn matrix as platelets. The hypoeutectic alloys show two endothermic peaks in DTA, which correspond to the eutectic and the liquidus temperatures. Three reaction layers are formed at the Sn–Zn/Cu interface without containing Sn: the thick γ–Cu5Zn8 adjacent to the solder, the thin β′–CuZn in the middle, and the thinnest layer adjacent to Cu. Although many nonwetting regions and voids are formed at the interface because of poor wetting, soldering at 290 °C can form a rigid interface, and tensile strength reaches about 40 MPa.

scholarly journals Effect of Trace Ge on Wettability and High-Temperature Oxidation Resistance of Sn-0.7Cu Lead-Free Solder

2016 ◽  
Vol 57 (10) ◽  
pp. 1685-1690
Author(s):  
Qing-meng Wang ◽  
Gui-sheng Gan ◽  
Yunfei Du ◽  
Donghua Yang ◽  
Guoqi Meng ◽  
...  
Keyword(s):  
High Temperature ◽  
Oxidation Resistance ◽  
High Temperature Oxidation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Oxidation ◽  
Free Solder

High-temperature lead-free solder alternatives

2011 ◽  
Vol 88 (6) ◽  
pp. 981-989 ◽  
Author(s):  
Vivek Chidambaram ◽  
Jesper Hattel ◽  
John Hald
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

The improvements of high temperature Zn-based lead free solder

2015 ◽  
Author(s):  
Xiaodan Wu ◽  
Jianxing Li ◽  
Tora Unuvar ◽  
Vemal Raja Manikam ◽  
Erik Nino Tolentino
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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