Effects of microstructure evolution on damage accumulation in lead-free solder joints

2010 ◽  
Author(s):  
Linlin Yang ◽  
Liang Yin ◽  
Brian Roggeman ◽  
Peter Borgesen
Keyword(s):  
Microstructure Evolution ◽  
Damage Accumulation ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Microstructure Evolution of Sn-3Ag-3Bi-3In/Cu Lead-free Solder Joints during Interval Aging

2018 ◽  
Vol 394 ◽  
pp. 022036
Author(s):  
Min Qu ◽  
Tianze Cao ◽  
Yan Cui ◽  
Fengbin Liu ◽  
Zhiwei Jiao ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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