Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

2006 ◽  
Author(s):  
Peng Sun ◽  
C. Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Surface Finish ◽  
Solder Joints ◽  
Compound Formation ◽  
Reflow Soldering ◽  
Intermetallic Compound Formation ◽  
Electroless Ni

Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

2006 ◽  
Vol 35 (5) ◽  
pp. 897-904 ◽  
Author(s):  
Yanghua Xia ◽  
Chuanyan Lu ◽  
Junling Chang ◽  
Xiaoming Xie
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Compound Formation ◽  
Intermetallic Compound Formation

Effect of reflow soldering profile on intermetallic compound formation

2015 ◽  
Vol 52 (4) ◽  
pp. 244 ◽  
Author(s):  
I. Siti Rabiatull Aisha ◽  
A. Ourdjini ◽  
M.A. Azmah Hanim ◽  
O. Saliza Azlina
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Reflow Soldering ◽  
Intermetallic Compound Formation

Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish

2016 ◽  
Vol 701 ◽  
pp. 127-131
Author(s):  
Hardinnawirda Kahar ◽  
Zetty Akhtar Abd Malek ◽  
Siti Rabiatull Aisha Idris ◽  
Mahadzir Ishak
Keyword(s):  
Intermetallic Compound ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Optical Microscope ◽  
Compound Formation ◽  
Intermetallic Compound Growth ◽  
Surface Finishes ◽  
Intermetallic Compound Formation ◽  
Free Solder ◽  
Immersion Tin

The formation and growth of the intermetallic were frequently discussed since lead free solder took place replacing the lead solder. However, the effect of multiple reflow process on the intermetallic morphology that was subjected to aging still needs further investigation. Thus, this study aimed to investigate the effect of second reflow towards the intermetallic compound formation and growth. Two types of surface finishes were used such as Immersion Tin (ImSn) and Electroless Nickel Immersion Gold (ENIG). Both test boards were reflowed once with Sn-3Ag-0.5Cu at the temperature of 225 °C and soaking for 8 seconds. Then, they were reflowed again at the same temperature for 25 minutes prior to an isothermal aging process for 250, 500, 1000 and 2000 hours at the temperature of 150 °C. The ProgRes C3 IM7200 Optical Microscope and ImageJ were used for the microstructural study, which includes morphology and thickness. Results indicated that IMC thickness formed between solder and ImSn surface finish increased significantly with 1.28 µm incremental when exposed to the second reflow. Whereas the IMC thickness of ENIG surface finish was increased for up to 0.15 µm. In addition, ENIG showed higher activation energy as compared to ImSn.

Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

2009 ◽  
Vol 57 (8) ◽  
pp. 2560-2566 ◽  
Author(s):  
Yu-Dong Lu ◽  
Xiao-Qi He ◽  
Yun-Fei En ◽  
Xin Wang ◽  
Zhi-Qiang Zhuang
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Compound Formation ◽  
Polarity Effect ◽  
Intermetallic Compound Formation ◽  
Snpb Solder
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