High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization

2006 ◽  
Vol 425 (1-2) ◽  
pp. 191-199 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Aging Study ◽  
High Temperature Aging ◽  
Electroless Ni ◽  
Temperature Aging

Features of Regularities of Ni3Al Intermetallic Compound High-Temperature Synthesis in a Powder Mixture (3Ni + Al) under Pressure

2018 ◽  
Vol 938 ◽  
pp. 41-45
Author(s):  
K.O. Akimov ◽  
E.N. Boyangin ◽  
Vladimir E. Ovcharenko
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Powder Mixture ◽  
Exothermic Reaction ◽  
Strength Properties ◽  
Grain Structure ◽  
Temperature Synthesis ◽  
Compound Formation ◽  
High Temperature Synthesis ◽  
Intermetallic Compound Formation

The results of investigation of the time and power parameters influence of high-temperature synthesis under pressure on the grain structure formation and strength properties of the Ni3Al intermetallic compound are presented and discussed. Dependences of the grain size in the intermetallic compound synthesized under pressure and its strength properties on the value of the preload on the initial powder mixture (3Ni + Al) and on the delay time of pressure application to the thermoreacting system were determined from the time of initiation of intermetallic compound formation volumetric exothermic reaction.

Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

2020 ◽  
Vol 272 ◽  
pp. 127891 ◽  
Author(s):  
Li Pu ◽  
Yingxia Liu ◽  
Yong Yang ◽  
Quanfeng He ◽  
Ziqing Zhou ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Compound Formation ◽  
Intermetallic Compound Formation
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