Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

Yanghua Xia; Chuanyan Lu; Junling Chang; Xiaoming Xie

doi:10.1007/bf02692545

Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints

Journal of Electronic Materials ◽

10.1007/bf02692545 ◽

2006 ◽

Vol 35 (5) ◽

pp. 897-904 ◽

Cited By ~ 13

Author(s):

Yanghua Xia ◽

Chuanyan Lu ◽

Junling Chang ◽

Xiaoming Xie

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration

Journal of Applied Physics ◽

10.1063/1.3410796 ◽

2010 ◽

Vol 107 (9) ◽

pp. 093715 ◽

Cited By ~ 10

Author(s):

S. W. Liang ◽

Chih Chen ◽

J. K. Han ◽

Luhua Xu ◽

K. N. Tu ◽

...

Keyword(s):

Intermetallic Compound ◽

Flip Chip ◽

Whisker Growth ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. ◽

10.1109/hdp.2006.1707608 ◽

2006 ◽

Author(s):

Peng Sun ◽

C. Andersson ◽

Xicheng Wei ◽

Zhaonian Cheng ◽

Dongkai Shangguan ◽

...

Keyword(s):

Intermetallic Compound ◽

Surface Finish ◽

Solder Joints ◽

Compound Formation ◽

Reflow Soldering ◽

Intermetallic Compound Formation ◽

Electroless Ni

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Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb–xCu solder joints

Science and Technology of Welding & Joining ◽

10.1179/174329308x277737 ◽

2008 ◽

Vol 13 (8) ◽

pp. 781-790 ◽

Cited By ~ 2

Author(s):

H. T. Lee ◽

W. Y. Huang ◽

Y. F. Chen

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints

Journal of Materials Research ◽

10.1557/jmr.2012.22 ◽

2012 ◽

Vol 27 (8) ◽

pp. 1169-1177 ◽

Cited By ~ 8

Author(s):

Hsiao-Yun Chen ◽

Chih Chen

Keyword(s):

Intermetallic Compound ◽

Kinetic Study ◽

Flip Chip ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

Image Position

Abstract

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Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Materials Science and Engineering B ◽

10.1016/j.mseb.2006.08.051 ◽

2006 ◽

Vol 135 (2) ◽

pp. 134-140 ◽

Cited By ~ 30

Author(s):

Peng Sun ◽

Cristina Andersson ◽

Xicheng Wei ◽

Zhaonian Cheng ◽

Dongkai Shangguan ◽

...

Keyword(s):

Intermetallic Compound ◽

Surface Finish ◽

Solder Joints ◽

Compound Formation ◽

Reflow Soldering ◽

Intermetallic Compound Formation ◽

Electroless Ni

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Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints

Acta Materialia ◽

10.1016/j.actamat.2009.02.015 ◽

2009 ◽

Vol 57 (8) ◽

pp. 2560-2566 ◽

Cited By ~ 47

Author(s):

Yu-Dong Lu ◽

Xiao-Qi He ◽

Yun-Fei En ◽

Xin Wang ◽

Zhi-Qiang Zhuang

Keyword(s):

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Polarity Effect ◽

Intermetallic Compound Formation ◽

Snpb Solder

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Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2014.11.208 ◽

2015 ◽

Vol 627 ◽

pp. 276-280 ◽

Cited By ~ 23

Author(s):

Jeong-Won Yoon ◽

Jung-Hwan Bang ◽

Chang-Woo Lee ◽

Seung-Boo Jung

Keyword(s):

Intermetallic Compound ◽

Interfacial Reaction ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints

Journal of Welding and Joining ◽

10.5781/kwjs.2007.25.2.082 ◽

2007 ◽

Vol 25 (2) ◽

pp. 82-88 ◽

Cited By ~ 4

Author(s):

Won-Sik Hong ◽

Whee-Sung Kim ◽

Noh-Chang Park ◽

Kwang-Bae Kim

Keyword(s):

Activation Energy ◽

Intermetallic Compound ◽

Solder Joints ◽

Compound Formation ◽

Intermetallic Compound Formation

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Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints

Microelectronics Reliability ◽

10.1016/j.microrel.2013.10.005 ◽

2014 ◽

Vol 54 (2) ◽

pp. 435-446 ◽

Cited By ~ 21

Author(s):

Chaoran Yang ◽

Fubin Song ◽

S.W. Ricky Lee

Keyword(s):

Intermetallic Compound ◽

Brittle Fracture ◽

Fracture Strength ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Compound Formation ◽

Intermetallic Compound Formation ◽

Free Solder

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Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation

Materials Letters ◽

10.1016/j.matlet.2020.127891 ◽

2020 ◽

Vol 272 ◽

pp. 127891 ◽

Cited By ~ 2

Author(s):

Li Pu ◽

Yingxia Liu ◽

Yong Yang ◽

Quanfeng He ◽

Ziqing Zhou ◽

...

Keyword(s):

Intermetallic Compound ◽

Compound Formation ◽

Intermetallic Compound Formation

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