Board level solder joint reliability modeling of Embedded Wafer Level BGA (eWLB) packages under temperature cycling test conditions

2011 ◽  
Author(s):  
Seng Guan Chow ◽  
Won Kyoung Choi ◽  
Roger Emigh ◽  
Eric Ouyang
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Cycling Test ◽  
Joint Reliability ◽  
Test Conditions ◽  
Temperature Cycling Test ◽  
Board Level

Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?

1989 ◽  
Vol 111 (4) ◽  
pp. 310-312 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Temperature Cycling Test ◽  
Cycling Life

We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

2008 ◽  
Vol 48 (4) ◽  
pp. 602-610 ◽  
Author(s):  
Xiaowu Zhang ◽  
Vaidyanathan Kripesh ◽  
T.C. Chai ◽  
Teck Chun Tan ◽  
D. Pinjala
Keyword(s):  
Solder Joint ◽  
Reliability Analysis ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Fine Pitch ◽  
Board Level ◽  
Wafer Level Package
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