Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?

1989 ◽  
Vol 111 (4) ◽  
pp. 310-312 ◽  
Author(s):  
E. Suhir
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Test Conditions ◽  
Power Cycling ◽  
Temperature Cycling Test ◽  
Cycling Life

We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.

Solder Joint Reliability Analysis of WLCSP Based on Inelastic Analysis

2006 ◽  
Vol 306-308 ◽  
pp. 643-648 ◽  
Author(s):  
Chia Lung Chang ◽  
Tzu-Jen Lin ◽  
Kenny Huang
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Shear Strain ◽  
Prediction Models ◽  
Inelastic Strain ◽  
Temperature Cycling ◽  
Cycling Test ◽  
Inelastic Analysis ◽  
Temperature Cycling Test ◽  
Total Shear

Nonlinear finite element analysis is performed to evaluate the reliability of the solder joint of wafer level chip scale package (WLCSP) under accelerated temperature cycling test. The solder joint is subjected to the inelastic strain that is generated during the temperature cycling test due to the thermal expansion mismatch between the various materials of the package and PCB (printed circuit board). The equivalent stress, equivalent inelastic strain, total shear strain, and hysteresis loop of the solder joint are determined in the simulation. The equivalent inelastic strain and total shear strain range of the joint are obtained as damage criterion to predict the solder fatigue. Both Coffin-Manson and Modified Coffin-Manson fatigue life prediction models are used to estimate the thermal fatigue life of WLCSP solder joints under temperature cycling test. Also, the effects of the material properties of the stress buffer layer (SBL) on the fatigue life of the solder joint are discussed.

Temperature Characteristics of Li-Ion Batteries

2014 ◽  
Vol 1008-1009 ◽  
pp. 274-276
Author(s):  
Hong Wei Wang ◽  
Zi Qiang Tao ◽  
Yan Ling Fu ◽  
Hong Bai ◽  
Hai Qing Xiao
Keyword(s):  
Temperature Cycling ◽  
Safety Performance ◽  
Quality And Safety ◽  
Li Ion Batteries ◽  
Temperature Characteristics ◽  
Cycling Test ◽  
Li Ion ◽  
Temperature Cycling Test

Two kinds of import laptop battery and one kind of domestic laptop battery were investigated in the temperature cycling test. The results showed that all the samples didn’t fire, explosion and leakage in the temperature cycling tests. But the shell glue of domestic laptop battery was disabled more serious then that of import laptop battery and it still exist some security risk.Therefore, There is a long way to go to investigate and improve the quality and safety performance of some laptop battery.

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

2011 ◽  
Author(s):  
Tomohiro Takahashi ◽  
Qiang Yu ◽  
Masahiro Kobayashi
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Structure ◽  
Inelastic Strain ◽  
Power Module ◽  
Thermal Fatigue Life ◽  
Power Cycling ◽  
Precision Evaluation

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

Fiber alignment shift in temperature cycling test

1998 ◽  
Author(s):  
Yih-Cheng Sheu ◽  
Cheng-Huang Chen ◽  
Chy-Pen Chien ◽  
Jao-Hwa Kuang ◽  
Wood-Hi Cheng ◽  
...  
Keyword(s):  
Temperature Cycling ◽  
Fiber Alignment ◽  
Cycling Test ◽  
Temperature Cycling Test
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