Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs

2009 ◽  
Vol 97 (1) ◽  
pp. 175-183 ◽  
Author(s):  
Z. W. Zhong ◽  
T. Y. Tee
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Joint Reliability ◽  
Board Level

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

2003 ◽  
Vol 43 (7) ◽  
pp. 1117-1123 ◽  
Author(s):  
Tong Yan Tee ◽  
Hun Shen Ng ◽  
Daniel Yap ◽  
Xavier Baraton ◽  
Zhaowei Zhong
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Reliability Modeling ◽  
Joint Reliability ◽  
Board Level

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

2005 ◽  
Author(s):  
Saketh Mahalingam ◽  
Ashutosh Joshi ◽  
Joseph Lacey ◽  
Kunal Goray
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Operating Temperature ◽  
Ball Grid Array ◽  
Solder Joint Reliability ◽  
Proper Understanding ◽  
Joint Reliability ◽  
Board Level ◽  
Inelastic Strains ◽  
Underfill Material

Chip Scale Packages (CSP) are ideal intermediates between Direct Chip Attach (DCA) and Ball Grid Array (BGA) technologies in terms of both size and cost. Depending upon the application, chip scale packages are either underfilled for better solder joint reliability or are attached with a heat sink to keep the operating temperature of the chip under control. In many applications, as discussed in this paper, both an underfill and a heat sink are required. Quite expectedly the addition of two more materials, heat sink and adhesive, in the board level assembly results in fresh reliability concerns. In particular, the requirements on the underfill material and the heat sink attach adhesive are more rigorous and needless to say, a proper understanding of process and material issues is needed to make such a choice. The inelastic strains experienced by the solder joint (related to the underfill) and the peeling stresses at the heat sink attach adhesive interfaces (related to the thermal adhesive) are used as metric for comparing the number of material choices that are available. Based on the results, it is shown that it is important to choose materials that are thermo-mechanically matched with the rest of the system.

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