Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

Research on the Board Level Reliability of High Density CBGA and CCGA under Thermal Cycling

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480488 ◽

2018 ◽

Cited By ~ 1

Author(s):

Liangyu Tong ◽

Changshun Jiang ◽

Guojun Ao

Keyword(s):

Thermal Cycling ◽

High Density ◽

Board Level ◽

Board Level Reliability

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Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu

Journal of Mechanical Science and Technology ◽

10.1007/s12206-013-1154-z ◽

2014 ◽

Vol 28 (3) ◽

pp. 879-886 ◽

Cited By ~ 10

Author(s):

Changwoon Han ◽

Bongtae Han

Keyword(s):

Thermal Cycling ◽

Reliability Analysis ◽

Comparison Study ◽

Board Level ◽

Board Level Reliability

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Evaluation of board level reliability of BGAs under thermal cycling test

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference ◽

10.1109/impact.2010.5699562 ◽

2010 ◽

Author(s):

Luo Tzeng-Cherng ◽

Liao Meng-Chieh ◽

Huang Te-Chun ◽

Huang Chen-Yu

Keyword(s):

Thermal Cycling ◽

Thermal Cycling Test ◽

Cycling Test ◽

Board Level ◽

Board Level Reliability

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Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.362 ◽

2016 ◽

Cited By ~ 1

Author(s):

Scott McCann ◽

Satoru Kuramochi ◽

Hobie Yun ◽

Venkatesh Sundaram ◽

M. Raj Pulugurtha ◽

...

Keyword(s):

Thermal Cycling ◽

Board Level ◽

Board Level Reliability

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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00251 ◽

2018 ◽

Cited By ~ 12

Author(s):

Shuai Shao ◽

Yuling Niu ◽

Jing Wang ◽

Ruiyang Liu ◽

Seungbae Park ◽

...

Keyword(s):

Thermal Cycling ◽

Package Design ◽

Power Cycling ◽

Board Level ◽

Board Level Reliability ◽

Comprehensive Study

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On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

Microelectronics Reliability ◽

10.1016/j.microrel.2006.05.009 ◽

2007 ◽

Vol 47 (2-3) ◽

pp. 444-449 ◽

Cited By ~ 16

Author(s):

J.W.C. de Vries ◽

M.Y. Jansen ◽

W.D. van Driel

Keyword(s):

Thermal Cycling ◽

Thermal Shock ◽

Shock Testing ◽

The Difference ◽

Board Level ◽

Board Level Reliability

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Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 International Wafer Level Packaging Conference (IWLPC) ◽

10.23919/iwlpc52010.2020.9375894 ◽

2020 ◽

Author(s):

Nishant Lakhera ◽

Burt Carpenter ◽

Trung Duong ◽

Mollie Benson ◽

Andrew J Mawer

Keyword(s):

Radar Applications ◽

Board Level ◽

Board Level Reliability

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Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.15-17.633 ◽

2006 ◽

Vol 15-17 ◽

pp. 633-638 ◽

Cited By ~ 1

Author(s):

Jong Woong Kim ◽

Hyun Suk Chun ◽

Sang Su Ha ◽

Jong Hyuck Chae ◽

Jin Ho Joo ◽

...

Keyword(s):

Thermal Shock ◽

Solder Joints ◽

Lead Frame ◽

Shear Forces ◽

Microstructural Investigation ◽

Shock Testing ◽

Ceramic Capacitor ◽

Board Level ◽

Board Level Reliability ◽

Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

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