On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

2007 ◽  
Vol 47 (2-3) ◽  
pp. 444-449 ◽  
Author(s):  
J.W.C. de Vries ◽  
M.Y. Jansen ◽  
W.D. van Driel
Keyword(s):  
Thermal Cycling ◽  
Thermal Shock ◽  
Shock Testing ◽  
The Difference ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
pp. 633-638
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Free Surface ◽  
Thermal Shock ◽  
Shock Testing ◽  
Board Level ◽  
Board Level Reliability

Reliability during Thermal Shock Testing of NiCr Films on Mn-Ni-Co Oxide Substrates

2006 ◽  
Vol 317-318 ◽  
pp. 553-556 ◽  
Author(s):  
Min Seok Jeon ◽  
Jun Kwang Song ◽  
Eui Jong Lee ◽  
Hee Soo Lee ◽  
Tae Hyung No ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Thermal Cycling ◽  
Thermal Shock ◽  
Failure Mechanism ◽  
Sheet Resistance ◽  
Temperature Cycling ◽  
Accelerated Testing ◽  
Initial Value ◽  
Shock Testing ◽  
Oxide Substrates

There is an increasing reliability concern of thermal stress-induced failures in multilevel coatings in recent years. This work reports investigations of cracking of NiCr coatings due to thermal cycling. The temperature cycling in accelerated testing was performed in three temperature range of 150, 175 and 200°C. The NiCr coatings were considered to have failed when the sheet resistance changed by 30% relative to an initial value. As the cyclic repetition of thermal shock increased, the sheet resistance of NiCr coatings increased. The Coffin-Manson equation was applied to the failure mechanism of cracking of NiCr coatings and the SEM observation of cracks and delamination in NiCr coatings due to thermal cycling agreed well with the failure mechanism.

Board-Level Reliability of 3D through Glass via Filters During Thermal Cycling

2016 ◽  
Author(s):  
Scott McCann ◽  
Satoru Kuramochi ◽  
Hobie Yun ◽  
Venkatesh Sundaram ◽  
M. Raj Pulugurtha ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Board Level ◽  
Board Level Reliability

Thermal Shock Testing as a Reliability Qualification Test for Lead-Free Solder

2006 ◽  
Author(s):  
Kunal Goray ◽  
Saketh Mahalingam ◽  
Amit Shah ◽  
Abhijit Dasgupta
Keyword(s):  
Thermal Cycling ◽  
Thermal Shock ◽  
Lead Free ◽  
Lead Free Solder ◽  
Shock Testing ◽  
Solder Interconnects ◽  
Thermal Cycling Testing ◽  
Accelerated Thermal Cycling ◽  
Free Solder ◽  
Sac Solder

Accelerated thermal cycling tests are used to ascertain the reliability of solder interconnects in electronics assemblies. These tests typically last a few months and therefore, are highly resource intensive. Thermal shock tests on the other hand are faster but have been found to be ineffective in accelerating thermal cycling failures for eutectic tin lead solder. In this paper, thermal shock testing is proposed as an alternative to conventional thermal cycling testing for lead-free solder interconnects using Sn, Ag and Cu (SAC) solder. Results from the thermal shock and thermal cycling testing of Ball-Grid-Array (BGA) components are presented. Failure analyses of the solder joints reveal the failure mode for thermal shock in comparison to thermal cycling testing. Numerical modeling results for the thermal cycling and thermal shock testing for lead free and eutectic lead solder are then presented and discussed. The simulation results agree with the experiments and theory is proposed to account for the similar trends between thermal cycling and thermal shock testing for lead free solder.

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