Low Temperature Fluxless Technology for Ultra-fine Pitch and Large Devices Flip-chip Bonding

2006 ◽  
Author(s):  
C. Davoine ◽  
M. Fendler ◽  
F. Marion ◽  
C. Louis ◽  
G. Destefanis ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Fine Pitch

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 ◽  
Author(s):  
Akiko Okada ◽  
Masatsugu Nimura ◽  
Naoko Unami ◽  
Akitsu Shigetou ◽  
Hirokazu Noma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
3D Integration ◽  
Flip Chip Bonding

Surface Activated Flip-Chip Bonding of Laser Chips

2005 ◽  
Author(s):  
Eiji Higurashi ◽  
Masao Nakagawa ◽  
Tadatomo Suga ◽  
Renshi Sawada
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Ambient Air ◽  
Failure Criteria ◽  
Rf Plasma ◽  
Cavity Surface ◽  
Si Substrate ◽  
Plasma Irradiation ◽  
Flip Chip Bonding

This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

scholarly journals Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding

2012 ◽  
Vol 22 (9) ◽  
pp. 454-458 ◽  
Author(s):  
Won-Jung Choi ◽  
Se-Hoon Yoo ◽  
Hyo-Soo Lee ◽  
Mok-Soon Kim ◽  
Jun-Ki Kim
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Epoxy Adhesives ◽  
Flip Chip Bonding

Corrections to "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process"

2007 ◽  
Vol 30 (2) ◽  
pp. 359-359
Author(s):  
Robert W. Kay ◽  
Stoyan Stoyanov ◽  
Greg P. Glinski ◽  
Chris Bailey ◽  
Marc P. Y. Desmulliez
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Low Cost ◽  
Assembly Process ◽  
Stencil Printing ◽  
Fine Pitch ◽  
Flip Chip Assembly
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