Electro-migration behavior in low temperature flip chip bonding

2012 ◽  
Author(s):  
Kei Murayama ◽  
Mitsutoshi Higashi ◽  
Taiji Sakai ◽  
Nobuaki Imaizumi
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Migration Behavior ◽  
Flip Chip Bonding

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 ◽  
Author(s):  
Akiko Okada ◽  
Masatsugu Nimura ◽  
Naoko Unami ◽  
Akitsu Shigetou ◽  
Hirokazu Noma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
3D Integration ◽  
Flip Chip Bonding

Surface Activated Flip-Chip Bonding of Laser Chips

2005 ◽  
Author(s):  
Eiji Higurashi ◽  
Masao Nakagawa ◽  
Tadatomo Suga ◽  
Renshi Sawada
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Bonding Temperature ◽  
Ambient Air ◽  
Failure Criteria ◽  
Rf Plasma ◽  
Cavity Surface ◽  
Si Substrate ◽  
Plasma Irradiation ◽  
Flip Chip Bonding

This paper reports the results of low-temperature flip-chip bonding of a vertical cavity surface emitting laser (VCSEL) on a micromachined Si substrate. Low temperature bonding was achieved by introducing the surface activation by plasma irradiation into the flip-chip bonding process. After the surfaces of the Au electrodes of the VCSEL and Si substrate were cleaned using an Ar radio frequency (RF) plasma, Au-Au bonding was carried out only by contact in ambient air with applied static pressure. At a bonding temperature of 100°C, the die-shear strength exceeded the failure criteria of MIL-STD-883.

Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps

2011 ◽  
Vol 2011 (1) ◽  
pp. 000997-001006 ◽  
Author(s):  
Kei Murayama ◽  
Taiji Sakai ◽  
Nobuaki Imaizumi ◽  
Mitsutoshi Higashi
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
High Reliability ◽  
Electron Flow ◽  
Organic Substrate ◽  
Cathode Side ◽  
Migration Behavior ◽  
Low Temperature Bonding ◽  
Electroless Ni ◽  
Interconnect Resistance

The bonding technique for high density Flip Chip(F.C.) packages requires a low temperature and a low stress process to achieve high reliability of the micro joining. Sn-Bi solder has been noted as a low temperature bonding material. Electromigration behavior of Sn-57wt%Bi flip chip interconnection with Cu post bumps was investigated. The flip chip bumps used for this experiments consisted of Cu post formed with plating and Sn-57wt%Bi solder. Two types of under bump metal(UBM) of organic substrate were studied, that is, electroless Ni(6μm)/Au(0.5μm) on Cu pad and Cu pad. Electron flow to induce the electro-migration was from organic substrate side (Cu pad) to chip side (Cu post) with current density of 40000A/cm2 at 125 degree C. At both types of the UBM, Bi migrated and accumulated to the anode side (Cu post) and Sn migrated to the cathode side (substrate pad). Each interconnect resistance has increased to about 25% and 46% within 100 hours, respectively. However, after more than 3000 hours, they were stabilized. With Ni/Au UBM pad, Cu3Sn/Cu6Sn5 intermetallic compounds (IMCs) were formed at the Cu bump side. And under the Bi layer Cu6Sn5/Ni-Sn compounds were formed. But we didn’t observe the failure like cracks or voids at the Ni layer. With Cu pad, only Cu3Sn IMC at the Cu bump side and under the Bi layer Cu6Sn5/Cu3Sn compounds were formed after 4000 hours. Although the voids were observed at Cu3Sn/Cu interface, good electrical connection was obtained.

15-µm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications

2014 ◽  
Vol 53 (4S) ◽  
pp. 04EB04 ◽  
Author(s):  
Bui Thanh Tung ◽  
Fumiki Kato ◽  
Naoya Watanabe ◽  
Shunsuke Nemoto ◽  
Katsuya Kikuchi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding ◽  
Bonding Technique

scholarly journals Effects of Hardeners on the Low-Temperature Snap Cure Behaviors of Epoxy Adhesives for Flip Chip Bonding

2012 ◽  
Vol 22 (9) ◽  
pp. 454-458 ◽  
Author(s):  
Won-Jung Choi ◽  
Se-Hoon Yoo ◽  
Hyo-Soo Lee ◽  
Mok-Soon Kim ◽  
Jun-Ki Kim
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Epoxy Adhesives ◽  
Flip Chip Bonding

Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment

2018 ◽  
Vol 47 (10) ◽  
pp. 5952-5958 ◽  
Author(s):  
Weixin Fu ◽  
Tatsushi Kaneda ◽  
Akiko Okada ◽  
Kaori Matsunaga ◽  
Shuichi Shoji ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flip Chip ◽  
Flip Chip Bonding
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